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BQ24165YFFT

Texas Instruments

BQ24165YFFT by Texas Instruments

BQ24165YFFT by Texas Instruments is a Power Management IC with 49 terminals, operating b/w -40 to 85°C. It supports supply voltages from 4.2V to 18V and has a BUCK switcher configuration. Ideal for industrial applications requiring precise power supply support circuits in compact form factors.

Median Price

$4.376

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$4.800

100+ parts

$4.206

1k+ parts

$2.376

10k+ parts

-

950

$4.800

$4.206

$2.376

-

Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$3.410

1k+ parts

$3.050

10k+ parts

$2.870

1,500

-

$3.410

$3.050

$2.870

DigiKey

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$4.490

1k+ parts

-

10k+ parts

-

1,500

-

$4.490

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.263

1k+ parts

$3.813

10k+ parts

$3.587

1,000

-

$4.263

$3.813

$3.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,999 parts In-Stock

1+ parts

$3.135

100+ parts

-

1k+ parts

-

10k+ parts

-

1,999

$3.135

-

-

-

Vyrian

USA . 4,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,676

-

-

-

-

DigiKey Marketplace

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,050 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

10k+ parts

-

4,050

$2.970

-

-

-

Corohmni

South Africa . 461 parts In-Stock

1+ parts

$3.270

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$3.270

-

-

-

Parana Technologies

USA . 965 parts In-Stock

1+ parts

$19.332

100+ parts

-

1k+ parts

$19.352

10k+ parts

-

965

$19.332

-

$19.352

-

DigiPath Technology Company

USA . 1,200 parts In-Stock

1+ parts

$21.287

100+ parts

$19.584

1k+ parts

-

10k+ parts

-

1,200

$21.287

$19.584

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.291

100+ parts

$19.375

1k+ parts

$17.459

10k+ parts

-

3,000

$21.291

$19.375

$17.459

-

ChromeModa Solutions

Germany . 6,644 parts In-Stock

1+ parts

$21.721

100+ parts

$17.811

1k+ parts

-

10k+ parts

-

6,644

$21.721

$17.811

-

-

IDEA Electronic Components Group

UK . 220 parts In-Stock

1+ parts

$21.721

100+ parts

$20.635

1k+ parts

$19.549

10k+ parts

-

220

$21.721

$20.635

$19.549

-

Microchip USA

USA . 1,123 parts In-Stock

1+ parts

$28.860

100+ parts

$28.680

1k+ parts

$28.590

10k+ parts

$28.500

1,123

$28.860

$28.680

$28.590

$28.500

Native Components

USA . 919 parts In-Stock

1+ parts

$586.870

100+ parts

$575.133

1k+ parts

$569.264

10k+ parts

$563.395

919

$586.870

$575.133

$569.264

$563.395

Northwest PG Solutions

USA . 1,031 parts In-Stock

1+ parts

$645.557

100+ parts

-

1k+ parts

-

10k+ parts

-

1,031

$645.557

-

-

-

Robosynatics

Brazil . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Lucentia Tech

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$13.463

1k+ parts

$12.467

10k+ parts

$12.467

950

-

$13.463

$12.467

$12.467

Kepictronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Overview

Experience unparalleled power management capabilities with the BQ24165YFFT by Texas Instruments. This cutting-edge Power Management IC offers a sleek package style, advanced surface mount technology, and a wide operating temperature range for maximum versatility. Perfect for a range of applications, this high-quality product ensures optimal performance and reliability. Trust in Texas Instruments to deliver top-of-the-line solutions that provide value, benefits, and advantages to meet your specific needs. Elevate your projects with the BQ24165YFFT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Being surface mountable makes it easier to integrate this Power Management IC into electronic devices and PCBs.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, enabling compact designs.

Power Supplies (V): 4.2/18

Supports a wide range of power supplies from 4.2V to 18V, making it versatile for various applications.

No. of Terminals: 49

Having 49 terminals allows for connection to multiple components and peripherals, expanding the functionality of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting and improved thermal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions, enhancing product flexibility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position enables easy soldering and connection to the PCB, simplifying assembly processes.

Maximum Seated Height: 0.625 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

Width (mm): 2.8 mm

The narrow width of 2.8mm supports compact and sleek product designs, especially for portable electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC enhances the efficiency and stability of power management in electronic systems.

Minimum Supply Voltage (Vsup): 4.2 V

The minimum supply voltage of 4.2V ensures compatibility with a wide range of power sources, offering flexibility in system design.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260C ensures reliable soldering during assembly, leading to robust product performance.

Length: 2.8 mm

The short length of 2.8mm contributes to space-saving designs, particularly in applications where size is a critical factor.

Nominal Threshold Voltage (V): +3.8V

The nominal threshold voltage of +3.8V ensures precise voltage regulation and stability in power supply applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates the IC's reliability and performance under harsh operating conditions.

Maximum Supply Current (Isup): 5 mA

Supporting a maximum supply current of 5mA, this IC can efficiently manage power consumption in electronic systems, enhancing energy efficiency.

Terminal Form: BALL

The ball terminal form facilitates secure connections and enables high-density mounting, contributing to a robust and reliable product design.

Switcher Config: BUCK

The BUCK switcher configuration offers efficient power conversion and regulation, making this IC suitable for various power management applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4mm allows for precise connections and high-density mounting, essential for compact electronic designs.

Maximum Supply Voltage (Vsup): 10 V

With a maximum supply voltage of 10V, this IC can handle a wide range of input voltages, making it versatile for diverse power supply applications.

Adjustable Threshold: YES

The adjustable threshold feature allows users to customize voltage settings as needed, providing flexibility and control in power management scenarios.

Technical Specifications

Power Management ICs BQ24165YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.2/18

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+3.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.8 mm

Trade Compliance

BQ24165YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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