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BQ24125RHLRG4

Texas Instruments

BQ24125RHLRG4 by Texas Instruments

BQ24125RHLRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 125°C. It supports a min supply voltage of 4.35V and has a max supply current of 5mA. Ideal for automotive applications due to its compact size and efficient buck switcher configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,084 parts In-Stock

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Digiode

USA . 2,887 parts In-Stock

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2,887

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Martec Srl

Italy . 298 parts In-Stock

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One Stop Electronics

USA . 239 parts In-Stock

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$5.500

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239

$5.500

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AZTECH Wire

Italy . 328 parts In-Stock

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$9.187

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328

$9.187

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Parana Technologies

USA . 561 parts In-Stock

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$16.860

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$17.102

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561

$16.860

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$17.102

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DigiPath Technology Company

USA . 1,203 parts In-Stock

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$18.565

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$17.080

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$18.565

$17.080

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ChromeModa Solutions

Germany . 5,175 parts In-Stock

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$18.944

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$15.534

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$18.944

$15.534

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IDEA Electronic Components Group

UK . 2,085 parts In-Stock

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$18.944

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$17.997

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$17.050

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2,085

$18.944

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$17.050

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Microchip USA

USA . 2,226 parts In-Stock

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$19.130

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$19.010

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$18.950

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$18.890

2,226

$19.130

$19.010

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$18.890

Native Components

USA . 930 parts In-Stock

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$77.410

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$74.314

930

$77.410

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$74.314

Northwest PG Solutions

USA . 1,949 parts In-Stock

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$85.151

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Corphita

USA . 4,258 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 298 parts In-Stock

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Component Connect

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Overview

Experience unmatched quality and reliability with the BQ24125RHLRG4 by Texas Instruments, a leader in Power Management ICs. This compact chip carrier offers seamless power supply support for a wide range of applications, including automotive. With a robust nickel/palladium/gold terminal finish and a temperature grade suitable for even the most demanding environments, this IC provides peace of mind and superior performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in power management ICs due to their durability and ability to withstand high temperatures.

Surface Mount: YES

Surface mount packaging allows for easier and more efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that can easily fit into various electronic designs and layouts.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and flexibility in designing power circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this power management IC can reliably operate in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in cold environments without any issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Maximum Seated Height: 1 mm

A low seated height allows for compact designs and efficient use of space on the PCB.

Nominal Threshold Voltage (V): +3.3V

The nominal threshold voltage of +3.3V makes this power management IC suitable for applications requiring a stable power supply at this voltage level.

Temperature Grade: AUTOMOTIVE

Being automotive-grade, this power management IC meets stringent quality and reliability standards for use in automotive electronics.

Technical Specifications

Power Management ICs BQ24125RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

BQ24125RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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