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BQ24093DGQT

Texas Instruments

BQ24093DGQT by Texas Instruments

BQ24093DGQT by Texas Instruments is a Power Management IC with 10 terminals, operating b/w -40 to 150°C. It supports supply voltages from 3.5V to 7V and has a max seated height of 1.1mm. Ideal for automotive applications due to its nickel palladium gold silver terminal finish and small outline package style.

Median Price

$1.725

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 636 parts In-Stock

1+ parts

$0.530

100+ parts

$0.520

1k+ parts

$0.510

10k+ parts

-

636

$0.530

$0.520

$0.510

-

Texas Instruments

USA . 91,234 parts In-Stock

1+ parts

$1.630

100+ parts

$1.254

1k+ parts

$0.660

10k+ parts

-

91,234

$1.630

$1.254

$0.660

-

DigiKey

USA . 384 parts In-Stock

1+ parts

$1.820

100+ parts

$1.083

1k+ parts

$1.020

10k+ parts

-

384

$1.820

$1.083

$1.020

-

Mouser Electronics

USA . 264 parts In-Stock

1+ parts

$1.820

100+ parts

$1.090

1k+ parts

$0.995

10k+ parts

$0.940

264

$1.820

$1.090

$0.995

$0.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 116 parts In-Stock

1+ parts

$0.871

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$0.871

-

-

-

Vyrian

USA . 4,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,992

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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250

-

-

-

-

Cyclops Electronics Ltd

UK . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,535 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

$0.825

-

-

-

Parana Technologies

USA . 51 parts In-Stock

1+ parts

$2.138

100+ parts

-

1k+ parts

$2.650

10k+ parts

-

51

$2.138

-

$2.650

-

DigiPath Technology Company

USA . 2,228 parts In-Stock

1+ parts

$2.354

100+ parts

$2.166

1k+ parts

-

10k+ parts

-

2,228

$2.354

$2.166

-

-

ChromeModa Solutions

Germany . 1,612 parts In-Stock

1+ parts

$2.402

100+ parts

$1.970

1k+ parts

-

10k+ parts

-

1,612

$2.402

$1.970

-

-

IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$2.402

100+ parts

-

1k+ parts

$2.162

10k+ parts

-

743

$2.402

-

$2.162

-

Perfect Parts

USA . 2,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,224

-

-

-

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Northwest PG Solutions

USA . 1,718 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,718

-

-

-

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Native Components

USA . 309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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309

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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50

-

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-

-

Overview

Experience reliable and efficient power management with the BQ24093DGQT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers a wide range of applications for various industries. From automotive to consumer electronics, this small outline package delivers exceptional performance and durability. With a nominal supply voltage of 4V and a maximum operating temperature of 150°C, this product ensures consistent power supply support circuit for your devices. Trust Texas Instruments for quality and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC.

Surface Mount: YES

Ease of installation and reduced space requirements on the PCB.

Nominal Supply Voltage (Vsup): 4 V

Suitable for low power applications and efficient energy usage.

No. of Terminals: 10

Sufficient number of terminals for connecting to external components and power sources.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Suitable for use in cold environments without loss of functionality.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides excellent conductivity and corrosion resistance for stable performance.

Width (mm): 3 mm

Compact size allows for space-efficient PCB layout.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process.

Nominal Threshold Voltage (V): +6.65V

Precise threshold voltage for accurate power management.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 1 mA

Low power consumption for energy-efficient operation.

Terminal Pitch: 0.5 mm

Fine pitch for precise soldering and connection to external components.

Maximum Supply Voltage (Vsup): 6.45 V

Wide range of supply voltage allows for flexibility in different applications.

Technical Specifications

Power Management ICs BQ24093DGQT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/7

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

6.45 V

Minimum Supply Voltage (Vsup):

4.45 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+6.65V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24093DGQT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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