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BQ24070RHLTG4

Texas Instruments

BQ24070RHLTG4 by Texas Instruments

BQ24070RHLTG4 by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It supports power supplies from 4.3V to 16V, with an adjustable threshold and max supply current of 2mA. Ideal for industrial applications requiring precise power supply support circuits in compact spaces.

Median Price

$5.380

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 603 parts In-Stock

1+ parts

$5.380

100+ parts

$2.760

1k+ parts

$1.920

10k+ parts

$1.900

603

$5.380

$2.760

$1.920

$1.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$2.080

-

-

-

Chip Stock

USA . 30,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30,340

-

-

-

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Vyrian

USA . 6,473 parts In-Stock

1+ parts

-

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-

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6,473

-

-

-

-

Sogenti Electronics

Canada . 3,875 parts In-Stock

1+ parts

-

100+ parts

-

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3,875

-

-

-

-

VNN

France . 3,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,379

-

-

-

-

Digiode

USA . 1,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,261

-

-

-

-

Prism Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

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10

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,130 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

$2.038

5,130

$2.080

-

-

$2.038

Argo Parts USA

USA . 1,489 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,489

$2.080

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.080

-

-

-

Parana Technologies

USA . 146 parts In-Stock

1+ parts

$3.113

100+ parts

-

1k+ parts

$3.633

10k+ parts

-

146

$3.113

-

$3.633

-

DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$3.428

100+ parts

-

1k+ parts

-

10k+ parts

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1,615

$3.428

-

-

-

IDEA Electronic Components Group

UK . 624 parts In-Stock

1+ parts

$3.498

100+ parts

-

1k+ parts

$3.148

10k+ parts

-

624

$3.498

-

$3.148

-

ChromeModa Solutions

Germany . 275 parts In-Stock

1+ parts

$3.498

100+ parts

$2.868

1k+ parts

-

10k+ parts

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275

$3.498

$2.868

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-

Ampacity Inc.

Singapore . 269 parts In-Stock

1+ parts

$4.300

100+ parts

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1k+ parts

-

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269

$4.300

-

-

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Corohmni

South Africa . 645 parts In-Stock

1+ parts

$9.059

100+ parts

-

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645

$9.059

-

-

-

AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$17.045

100+ parts

-

1k+ parts

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767

$17.045

-

-

-

Advanced Electronics

New Zealand . 3,553 parts In-Stock

1+ parts

$26.585

100+ parts

$26.320

1k+ parts

$25.256

10k+ parts

-

3,553

$26.585

$26.320

$25.256

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

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3,790

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-

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Microchip USA

USA . 2,346 parts In-Stock

1+ parts

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2,346

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Corphita

USA . 1,776 parts In-Stock

1+ parts

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100+ parts

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1,776

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Overview

Experience reliable and efficient power management with the BQ24070RHLTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are versatile and dependable. Whether you're looking for a solution for your industrial applications or need a power supply support circuit, this product offers a wide range of benefits and advantages. With features like adjustable threshold and a maximum supply voltage of 16V, the BQ24070RHLTG4 is the perfect choice for your power management needs. Trust Texas Instruments to provide you with the best in class power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes this Power Management IC easy to integrate and saves space on the PCB, making it ideal for compact designs.

Power Supplies (V): 4.3/16

With a wide range of power supply voltages supported, this IC can be used in various applications with different power requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this IC to withstand harsh environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this IC can operate in cold environments without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Width (mm): 3.5 mm

The compact width of the IC enables it to be used in space-constrained applications, offering flexibility in design.

Minimum Supply Voltage (Vsup): 4.35 V

The low minimum supply voltage requirement enables this IC to operate even with limited power sources, making it energy-efficient.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling more components to be placed in a limited space.

Adjustable Threshold: YES

Having an adjustable threshold makes this IC versatile, as it can be customized for different voltage requirements, enhancing its usability.

Technical Specifications

Power Management ICs BQ24070RHLTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.3/16

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24070RHLTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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