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BQ24038RHLRG4

Texas Instruments

BQ24038RHLRG4 by Texas Instruments

BQ24038RHLRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating voltage range of 4.5-16V, and adjustable threshold feature. It is designed for industrial applications, offering a compact chip carrier package with very thin profile suitable for surface mount assembly. With a temperature range of -40 to 85°C, it provides efficient power supply support circuitry in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,941 parts In-Stock

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5,941

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Chip Stock

USA . 3,739 parts In-Stock

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3,739

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Digiode

USA . 1,503 parts In-Stock

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1,503

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Cyclops Electronics Ltd

UK . 16 parts In-Stock

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16

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Distributors (Availability)

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Parana Technologies

USA . 2,256 parts In-Stock

1+ parts

$3.746

100+ parts

-

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$4.244

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2,256

$3.746

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$4.244

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DigiPath Technology Company

USA . 2,067 parts In-Stock

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$4.125

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$3.795

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2,067

$4.125

$3.795

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ChromeModa Solutions

Germany . 5,751 parts In-Stock

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$4.209

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$3.451

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$4.209

$3.451

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IDEA Electronic Components Group

UK . 507 parts In-Stock

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$4.209

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$3.788

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507

$4.209

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$3.788

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One Stop Electronics

USA . 129 parts In-Stock

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$6.500

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129

$6.500

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AZTECH Wire

Italy . 795 parts In-Stock

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$10.046

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795

$10.046

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Kepictronics

USA . 45,500 parts In-Stock

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45,500

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Corphita

USA . 4,839 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Microchip USA

USA . 2,623 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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Northwest PG Solutions

USA . 1,288 parts In-Stock

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Native Components

USA . 969 parts In-Stock

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969

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Overview

Enhance your power management solutions with the BQ24038RHLRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that cater to a wide range of applications. From its compact package shape to its adjustable threshold feature, this product offers unmatched value and benefits to customers seeking efficient and reliable power supplies. Upgrade your systems today with the BQ24038RHLRG4 and experience the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Power Supplies (V): 4.5/16

This product supports a wide range of power supply voltages, offering flexibility in different usage scenarios.

No. of Terminals: 20

With 20 terminals, this product can accommodate a variety of connections and functions, enhancing its versatility.

Maximum Operating Temperature: 85 °C

This high operating temperature allows the product to perform reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the product can operate in extreme conditions without malfunctioning.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent conductivity and corrosion resistance, ensuring stable connections for the product.

Maximum Supply Current (Isup): 2 mA

With a low supply current requirement, this product helps in reducing power consumption and improving energy efficiency.

Technical Specifications

Power Management ICs BQ24038RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/16

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.55 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

BQ24038RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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