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BQ24023DRCRG4

Texas Instruments

BQ24023DRCRG4 by Texas Instruments

BQ24023DRCRG4 by Texas Instruments is a Power Management IC with 10 terminals, operating voltage of 4.5-6.5V, and temp range of -40 to 85°C. Ideal for industrial applications requiring power supply support circuits in compact spaces due to its small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,561 parts In-Stock

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8,561

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Digiode

USA . 4,343 parts In-Stock

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4,343

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Bristol Electronics

USA . 3,000 parts In-Stock

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3,000

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Semicontronic

India . 1,536 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,536

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

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$0.500

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$0.500

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One Stop Electronics

USA . 670 parts In-Stock

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$4.500

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670

$4.500

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AZTECH Wire

Italy . 430 parts In-Stock

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$12.361

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430

$12.361

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Parana Technologies

USA . 887 parts In-Stock

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$14.770

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$15.208

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887

$14.770

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$15.208

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ChromeModa Solutions

Germany . 6,122 parts In-Stock

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$16.596

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$13.609

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$16.596

$13.609

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IDEA Electronic Components Group

UK . 2,230 parts In-Stock

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$16.596

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$15.766

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$14.936

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$15.766

$14.936

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Kepictronics

USA . 8,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,404 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,936 parts In-Stock

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Corphita

USA . 3,644 parts In-Stock

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Northwest PG Solutions

USA . 2,302 parts In-Stock

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$14.963

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$14.963

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Native Components

USA . 950 parts In-Stock

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950

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Microchip USA

USA . 341 parts In-Stock

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341

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Corohmni

South Africa . 60 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the BQ24023DRCRG4 by Texas Instruments. This high-quality Power Management IC offers unparalleled reliability and efficiency, making it the perfect choice for a wide range of applications. Whether you're looking to enhance your power supply support circuit or improve overall performance, this product delivers superior results. Trust in Texas Instruments' reputation for excellence and unlock the endless possibilities that the BQ24023DRCRG4 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the package lightweight and durable, which is ideal for portable electronic devices.

Surface Mount: YES

The surface mount capability allows for easy and convenient integration onto circuit boards, saving space and reducing assembly time.

Power Supplies (V): 4.5/6.5

Supports a wide range of power supplies, making it versatile and compatible with different applications.

No. of Terminals: 10

Having 10 terminals allows for multiple connections and functionalities, providing flexibility in design and use.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments, expanding the range of applications for this product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process during assembly without any damage.

Temperature Grade: INDUSTRIAL

Being industrial-grade means that this product is designed to meet the high standards and reliability required in industrial applications.

Technical Specifications

Power Management ICs BQ24023DRCRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/6.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24023DRCRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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