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BQ20Z75DBTR-V160G4

Texas Instruments

BQ20Z75DBTR-V160G4 by Texas Instruments

BQ20Z75DBTR-V160G4 by Texas Instruments is a Power Management IC with 38 terminals, operating b/w -40 to 85°C. It features a nominal voltage of 14V and supports a min supply voltage of 4.5V, making it ideal for industrial applications requiring power supply management circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 8,995 parts In-Stock

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Vyrian

USA . 6,335 parts In-Stock

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6,335

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Digiode

USA . 1,127 parts In-Stock

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1,127

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Nova Conductors

Japan . 500 parts In-Stock

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500

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VNN

France . 100 parts In-Stock

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100

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One Stop Electronics

USA . 1,210 parts In-Stock

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$2.500

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$2.500

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Ampacity Inc.

Singapore . 834 parts In-Stock

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$6.500

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834

$6.500

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AZTECH Wire

Italy . 275 parts In-Stock

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$6.793

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$6.793

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Corohmni

South Africa . 629 parts In-Stock

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$15.619

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Parana Technologies

USA . 2,090 parts In-Stock

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$20.294

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$20.300

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ChromeModa Solutions

Germany . 3,181 parts In-Stock

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$22.802

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$18.698

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

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$22.802

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$21.662

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$20.522

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Microchip USA

USA . 12,353 parts In-Stock

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Continental Prestige Electronics

USA . 5,857 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,817 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,878 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,259 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Argo Parts USA

USA . 382 parts In-Stock

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Overview

Elevate your power management solutions with the BQ20Z75DBTR-V160G4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This Power Management IC offers unmatched performance in a compact package, making it ideal for a wide range of applications. Experience seamless operation and precise control with this innovative product, designed to meet the needs of today's demanding customers. Trust Texas Instruments to deliver superior quality and value, ensuring your projects run smoothly and efficiently every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and lightweight design, making this product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 14 V

With a nominal supply voltage of 14V, this power management IC is suitable for many electronic devices requiring a stable power source.

No. of Terminals: 38

Having 38 terminals provides ample connectivity options, allowing this IC to handle complex power management tasks effectively.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures this power management IC can operate in a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of this package style saves valuable board space and allows for efficient heat dissipation, making it a versatile choice for various applications.

Width (mm): 4.4 mm

The narrow width of 4.4mm makes this IC suitable for compact electronic devices where space is limited.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC is designed to regulate and control power distribution effectively, ensuring stable and efficient operation of electronic systems.

Maximum Supply Voltage (Vsup): 25 V

With a maximum supply voltage of 25V, this power management IC can handle high voltage requirements, making it suitable for a wide range of applications.

Technical Specifications

Power Management ICs BQ20Z75DBTR-V160G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

BQ20Z75DBTR-V160G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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