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BQ20Z70PWRG4

Texas Instruments

BQ20Z70PWRG4 by Texas Instruments

BQ20Z70PWRG4 by Texas Instruments is a Power Management IC with 2.5V nominal voltage, -40 to 85°C operating temperature range, and 20 terminals in a small outline package. Ideal for industrial applications requiring power supply management circuits with a compact design and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,635 parts In-Stock

1+ parts

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6,635

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Digiode

USA . 3,834 parts In-Stock

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3,834

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 148 parts In-Stock

1+ parts

$0.500

100+ parts

-

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148

$0.500

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Ampacity Inc.

Singapore . 385 parts In-Stock

1+ parts

$3.500

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-

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385

$3.500

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Semicontronic

India . 622 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

622

$6.500

$6.338

$6.305

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Parana Technologies

USA . 943 parts In-Stock

1+ parts

$11.003

100+ parts

$1,021.802

1k+ parts

$9.903

10k+ parts

-

943

$11.003

$1,021.802

$9.903

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DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

$12.116

100+ parts

$11.146

1k+ parts

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935

$12.116

$11.146

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ChromeModa Solutions

Germany . 2,860 parts In-Stock

1+ parts

$12.363

100+ parts

$10.138

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2,860

$12.363

$10.138

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IDEA Electronic Components Group

UK . 2,315 parts In-Stock

1+ parts

$12.363

100+ parts

$11.745

1k+ parts

$11.127

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2,315

$12.363

$11.745

$11.127

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AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$16.725

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774

$16.725

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Corphita

USA . 3,093 parts In-Stock

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3,093

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Northwest PG Solutions

USA . 2,201 parts In-Stock

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2,201

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Native Components

USA . 989 parts In-Stock

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989

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Corohmni

South Africa . 424 parts In-Stock

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424

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Microchip USA

USA . 168 parts In-Stock

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168

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Overview

Elevate your power management needs with the BQ20Z70PWRG4 from Texas Instruments. This high-quality Power Management IC offers unparalleled reliability and efficiency in a compact, easy-to-install package. Perfect for a wide range of applications, this product provides exceptional value by optimizing power supplies and enhancing overall performance. Trust in Texas Instruments' reputation for superior innovation and choose the BQ20Z70PWRG4 for all your power management challenges.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

The surface mount capability allows for easier and more efficient PCB assembly, making the product suitable for automated manufacturing processes.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5 V nominal supply voltage is a common standard for many electronic devices, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments or under heavy load conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and efficient electrical connections.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this Power Management IC is designed to operate reliably in demanding industrial applications with extended temperature ranges.

Technical Specifications

Power Management ICs BQ20Z70PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

2.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ20Z70PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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