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BQ2084DBT-V133G4

Texas Instruments

BQ2084DBT-V133G4 by Texas Instruments

BQ2084DBT-V133G4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 38 terminals, and small outline package style. It is used in power supply support circuits for applications requiring a max operating temperature of 85°C and min operating temperature of -20°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,875 parts In-Stock

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4,875

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Vyrian

USA . 3,648 parts In-Stock

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3,648

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Distributors (Availability)

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Semicontronic

India . 196 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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-

196

$6.500

$6.338

$6.305

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One Stop Electronics

USA . 293 parts In-Stock

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$7.500

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293

$7.500

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AZTECH Wire

Italy . 511 parts In-Stock

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$17.688

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511

$17.688

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Parana Technologies

USA . 1,943 parts In-Stock

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$21.280

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$21.590

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1,943

$21.280

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$21.590

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ChromeModa Solutions

Germany . 4,927 parts In-Stock

1+ parts

$23.910

100+ parts

$19.606

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4,927

$23.910

$19.606

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IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$23.910

100+ parts

$22.714

1k+ parts

$21.519

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780

$23.910

$22.714

$21.519

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Component Stockers USA

USA . 352 parts In-Stock

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$99.990

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352

$99.990

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Native Components

USA . 833 parts In-Stock

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$548.925

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$537.946

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$532.457

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$526.968

833

$548.925

$537.946

$532.457

$526.968

Northwest PG Solutions

USA . 2,352 parts In-Stock

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$603.817

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2,352

$603.817

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Corphita

USA . 4,004 parts In-Stock

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4,004

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DigiPath Technology Company

USA . 1,854 parts In-Stock

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$21.557

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1,854

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$21.557

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Corohmni

South Africa . 397 parts In-Stock

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397

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Microchip USA

USA . 243 parts In-Stock

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243

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Overview

Experience the next level of power management with the BQ2084DBT-V133G4 by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that provide efficiency and reliability. This versatile product is designed for a wide range of applications, offering customers a seamless integration into their systems. With its advanced features and robust construction, the BQ2084DBT-V133G4 ensures optimal performance and longevity, making it the ideal choice for all your power management needs. Unlock the potential of your devices with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a common supply voltage of 3.3V, making it compatible with many systems and devices.

No. of Terminals: 38

With a high number of terminals, this product offers versatile connectivity options and interfaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is reliable in a variety of environments.

Width (mm): 4.4 mm

Compact width size allows for space-saving integration into electronic circuits and devices.

Technical Specifications

Power Management ICs BQ2084DBT-V133G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ2084DBT-V133G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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