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BQ2060A-E619DBQG4

Texas Instruments

BQ2060A-E619DBQG4 by Texas Instruments

BQ2060A-E619DBQG4 by Texas Instruments is a Power Management IC with 28 terminals, operating at -20 to 70°C. It has a supply voltage range of 2.7V to 3.7V and features adjustable threshold levels for power supply support circuits. This rectangular-shaped IC in small outline package is suitable for applications requiring precise power management in compact spaces.

Median Price

$15.162

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,539 parts In-Stock

1+ parts

$15.162

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1,539

$15.162

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Vyrian

USA . 2,082 parts In-Stock

1+ parts

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2,082

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VNN

France . 75 parts In-Stock

1+ parts

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75

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 801 parts In-Stock

1+ parts

$9.771

100+ parts

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801

$9.771

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AZTECH Wire

Italy . 329 parts In-Stock

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$12.481

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329

$12.481

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Parana Technologies

USA . 1,596 parts In-Stock

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$13.373

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$13.891

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1,596

$13.373

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$13.891

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$13.570

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34

$13.570

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Corphita

USA . 4,832 parts In-Stock

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$14.364

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$14.364

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ChromeModa Solutions

Germany . 5,354 parts In-Stock

1+ parts

$15.026

100+ parts

$12.321

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5,354

$15.026

$12.321

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IDEA Electronic Components Group

UK . 926 parts In-Stock

1+ parts

$15.026

100+ parts

$14.275

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$13.523

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926

$15.026

$14.275

$13.523

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Argo Parts USA

USA . 4,924 parts In-Stock

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Microchip USA

USA . 2,155 parts In-Stock

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2,155

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DigiPath Technology Company

USA . 1,443 parts In-Stock

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$13.547

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1,443

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$13.547

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Bastille Electronics

Australia . 300 parts In-Stock

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Continental Prestige Electronics

USA . 219 parts In-Stock

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Perfect Parts

USA . 17 parts In-Stock

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Overview

Discover the power of the BQ2060A-E619DBQG4 by Texas Instruments, a top-quality Power Management IC designed to enhance efficiency and performance. With a reputation for excellence in manufacturing, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This versatile product offers customers unparalleled value with its advanced features, compact design, and adjustable threshold capabilities. Experience the benefits of reliable power management with the BQ2060A-E619DBQG4 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-lasting performance.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Package Shape: RECTANGULAR

Standard shape for easy integration into various electronic systems.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a wide range of devices that require this voltage for operation.

No. of Terminals: 28

Sufficient number of terminals for multiple connections and configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design allows for high-density mounting on PCBs.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even under high-temperature conditions.

Minimum Operating Temperature: -20 °C

Suitable for use in environments with lower temperatures without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for increased longevity and stable connections.

Terminal Position: DUAL

Provides flexibility in mounting options to suit different PCB layouts.

Maximum Seated Height: 1.75 mm

Low profile design for efficient space utilization in compact electronic devices.

Width (mm): 3.9 mm

Slim width for compatibility with narrow PCB layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed to enhance power management capabilities and optimize energy efficiency.

Minimum Supply Voltage (Vsup): 2.7 V

Supports lower supply voltage requirements for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High-temperature tolerance for robust soldering and thermal stability.

Length: 9.9 mm

Compact length for space-saving integration in various electronic devices.

No. of Channels: 4

Multiple channels offer versatility and compatibility with diverse power management systems.

Terminal Form: GULL WING

Secure terminal form for stable connections and easy soldering.

Terminal Pitch: 0.635 mm

Standard terminal pitch for compatibility with common PCB layouts.

Moisture Sensitivity Level (MSL): 2

Suitable for use in environments with moderate moisture exposure.

Maximum Supply Voltage (Vsup): 3.7 V

Supports higher supply voltage requirements for enhanced power management capabilities.

Adjustable Threshold: YES

Provides flexibility in adjusting voltage thresholds for customized power management solutions.

Technical Specifications

Power Management ICs BQ2060A-E619DBQG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2060A-E619DBQG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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