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BQ2050HSN-A508TRG4

Texas Instruments

BQ2050HSN-A508TRG4 by Texas Instruments

BQ2050HSN-A508TRG4 by Texas Instruments is a Power Management IC with 16 terminals, operating b/w 0-70°C. It supports supply voltages from 3-6.5V and has a compact rectangular package style for surface mounting applications in power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,144 parts In-Stock

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6,144

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Chip Stock

USA . 4,530 parts In-Stock

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4,530

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Digiode

USA . 1,152 parts In-Stock

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1,152

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Distributors (Availability)

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One Stop Electronics

USA . 378 parts In-Stock

1+ parts

$1.500

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-

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378

$1.500

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Semicontronic

India . 793 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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-

793

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 938 parts In-Stock

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$5.500

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938

$5.500

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Parana Technologies

USA . 644 parts In-Stock

1+ parts

$8.354

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$8.982

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644

$8.354

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$8.982

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DigiPath Technology Company

USA . 1,481 parts In-Stock

1+ parts

$9.198

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1,481

$9.198

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ChromeModa Solutions

Germany . 5,413 parts In-Stock

1+ parts

$9.386

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$7.697

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5,413

$9.386

$7.697

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IDEA Electronic Components Group

UK . 21 parts In-Stock

1+ parts

$9.386

100+ parts

$8.917

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$8.447

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21

$9.386

$8.917

$8.447

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AZTECH Wire

Italy . 473 parts In-Stock

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$18.750

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473

$18.750

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Native Components

USA . 880 parts In-Stock

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$57.590

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$55.286

880

$57.590

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$55.286

Northwest PG Solutions

USA . 2,154 parts In-Stock

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$63.349

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$63.349

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,996 parts In-Stock

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Kepictronics

USA . 4,550 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,997 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 2,410 parts In-Stock

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2,410

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Corphita

USA . 2,066 parts In-Stock

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2,066

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Corohmni

South Africa . 193 parts In-Stock

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193

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Overview

Unlock the power of efficient energy management with the Texas Instruments BQ2050HSN-A508TRG4 Power Management IC. Designed with precision and reliability in mind, Texas Instruments is a trusted manufacturer known for delivering top-quality products. Ideal for a wide range of applications, this Power Management IC offers unparalleled value to customers looking for superior performance and reliability. Say goodbye to worries about supply voltage or operating temperatures, and experience the benefits of seamless power supply support with the BQ2050HSN-A508TRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product and making it more cost-effective.

Surface Mount: YES

Being surface mountable makes this product easier to assemble onto PCBs, saving time and effort during manufacturing.

Nominal Supply Voltage: 4.25 V

The specified nominal supply voltage of 4.25 V ensures compatibility with a wide range of electronic devices, making it versatile in its application.

No. of Terminals: 16

Having 16 terminals allows for multiple connections to various components, offering flexibility in circuit design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for use in various environments without risking damage due to overheating.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold as terminal finish ensures good conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Width: 3.935 mm

The compact width of 3.935 mm makes this product suitable for space-constrained applications where size is a critical factor.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with lower power devices, making this product versatile in its application.

Technical Specifications

Power Management ICs BQ2050HSN-A508TRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.97 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.78 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.935 mm

Trade Compliance

BQ2050HSN-A508TRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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