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BQ2040SN-D111TRG4

Texas Instruments

BQ2040SN-D111TRG4 by Texas Instruments

BQ2040SN-D111TRG4 by Texas Instruments is a Power Management IC with 16 terminals, Vsup range of 3-6.5V, and operating temp from 0-70°C. It is a small outline package suitable for power supply support circuits in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,932 parts In-Stock

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7,932

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Vyrian

USA . 5,829 parts In-Stock

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5,829

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Digiode

USA . 2,187 parts In-Stock

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2,187

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VNN

France . 1,337 parts In-Stock

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1,337

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Nova Conductors

Japan . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 201 parts In-Stock

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$2.500

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201

$2.500

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Ampacity Inc.

Singapore . 1,598 parts In-Stock

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$3.500

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1,598

$3.500

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AZTECH Wire

Italy . 602 parts In-Stock

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$6.982

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602

$6.982

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Parana Technologies

USA . 1,823 parts In-Stock

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$9.636

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$10.229

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1,823

$9.636

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$10.229

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DigiPath Technology Company

USA . 298 parts In-Stock

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$10.610

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$9.762

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298

$10.610

$9.762

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ChromeModa Solutions

Germany . 5,016 parts In-Stock

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$10.827

100+ parts

$8.878

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5,016

$10.827

$8.878

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IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$10.827

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$10.286

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$9.744

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1,188

$10.827

$10.286

$9.744

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Microchip USA

USA . 2,979 parts In-Stock

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Corphita

USA . 1,445 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your power management capabilities with the BQ2040SN-D111TRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch Power Management ICs that are perfect for a wide range of applications. With its small outline package and adjustable threshold feature, this product offers unmatched value and benefits to customers looking for efficient power supply support circuits. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a suitable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package offers compatibility with standard PCB layouts, enhancing ease of integration.

Nominal Supply Voltage (Vsup): 4.25 V

The nominal supply voltage of 4.25 V ensures stable power delivery, making it a dependable choice for powering various devices.

No. of Terminals: 16

With 16 terminals, this IC provides ample connectivity options for versatile applications, making it a flexible solution.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures efficient use of board space, making it suitable for compact devices and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high-temperature environments, increasing its reliability.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall durability of the IC.

Terminal Position: DUAL

The dual terminal position offers increased flexibility in PCB layout and connection options, making it a versatile choice for different designs.

Maximum Seated Height: 1.75 mm

The maximum seated height of 1.75 mm allows for low-profile installations, making it suitable for space-constrained applications.

Width (mm): 3.9 mm

With a width of 3.9 mm, this IC offers a compact form factor, making it ideal for small devices and systems.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC provides power supply support circuitry, offering enhanced functionality and reliability in powering electronic devices.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources, increasing the versatility of this IC.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and robust connection, improving overall performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand high-temperature soldering processes, ensuring durable assembly.

Length: 9.9 mm

The length of 9.9 mm offers a compact footprint, making it suitable for space-constrained applications and designs.

Temperature Grade: COMMERCIAL

This IC is rated for commercial temperature grades, ensuring reliable operation in standard operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical stability and easy soldering, enhancing the overall robustness of the IC.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this IC offers compatibility with standard PCB layouts, making it easy to integrate into various designs.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates the level of protection against moisture, ensuring reliable performance in humid environments.

Maximum Supply Voltage (Vsup): 6.5 V

The maximum supply voltage of 6.5 V allows for compatibility with a wide range of power sources, increasing the versatility of this IC.

Adjustable Threshold: YES

The adjustable threshold feature provides customization options for power management settings, making this IC suitable for various applications.

Technical Specifications

Power Management ICs BQ2040SN-D111TRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2040SN-D111TRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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