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BQ2012SN-D107G4

Texas Instruments

BQ2012SN-D107G4 by Texas Instruments

BQ2012SN-D107G4 by Texas Instruments is a Power Management IC with 16 terminals, Vsup range of 3-6.5V, and operating temp from 0-70°C. It is a small outline package suitable for power supply support circuits in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,753 parts In-Stock

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Vyrian

USA . 3,228 parts In-Stock

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3,228

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Distributors (Availability)

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Semicontronic

India . 1,407 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

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$0.485

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1,407

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 592 parts In-Stock

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$3.500

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592

$3.500

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One Stop Electronics

USA . 1,180 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 1,902 parts In-Stock

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$5.653

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$6.449

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1,902

$5.653

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$6.449

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ChromeModa Solutions

Germany . 1,078 parts In-Stock

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$6.352

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$5.209

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$6.352

$5.209

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IDEA Electronic Components Group

UK . 139 parts In-Stock

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$6.352

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$5.717

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139

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AZTECH Wire

Italy . 235 parts In-Stock

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$15.378

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QUARKTWIN TECHNOLOGY LTD

USA . 16,287 parts In-Stock

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Microchip USA

USA . 4,971 parts In-Stock

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Corphita

USA . 3,195 parts In-Stock

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Northwest PG Solutions

USA . 1,084 parts In-Stock

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DigiPath Technology Company

USA . 799 parts In-Stock

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$5.727

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Native Components

USA . 635 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Experience the quality and reliability of Texas Instruments with the BQ2012SN-D107G4 Power Management IC. Perfect for a wide range of applications, this small outline package offers customers a high-value solution for their power supply support circuit needs. With a commercial temperature grade and dual terminal position, this IC provides peace of mind with its proven performance and durability. Trust in Texas Instruments for innovative solutions that deliver results.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product suitable for long-term use.

Surface Mount : YES

With surface mount capability, this product can be easily integrated into electronic circuits, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup) : 4.25 V

The nominal supply voltage of 4.25 V ensures stable power delivery, making this IC suitable for a wide range of applications.

No. of Terminals : 16

The 16 terminals allow for versatile connectivity options, making this IC compatible with various circuit configurations.

Maximum Operating Temperature : 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature : 0 °C

The minimum operating temperature of 0 °C ensures this IC can function effectively in low temperature conditions, making it suitable for diverse applications.

Terminal Finish : Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and longevity.

Width (mm) : 3.9 mm

The compact width of 3.9 mm allows for efficient space utilization in electronic designs, making this IC suitable for compact devices.

Temperature Grade : COMMERCIAL

The commercial temperature grade indicates that this IC is suitable for standard commercial applications, making it a versatile choice for various industries.

Moisture Sensitivity Level (MSL) : 2

With a moisture sensitivity level of 2, this IC can withstand moderate exposure to moisture during handling and assembly processes, ensuring reliability.

Technical Specifications

Power Management ICs BQ2012SN-D107G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

BQ2012SN-D107G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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