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BQ2010SN-D107TRG4

Texas Instruments

BQ2010SN-D107TRG4 by Texas Instruments

BQ2010SN-D107TRG4 by Texas Instruments is a Power Management IC with Vsup ranging from 3V to 6.5V, suitable for power supply support circuits. It features a small outline package style, dual terminal position, and operates in temperatures from 0°C to 70°C. Ideal for applications requiring precise voltage monitoring and control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 24,500 parts In-Stock

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24,500

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Vyrian

USA . 6,894 parts In-Stock

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6,894

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Digiode

USA . 1,172 parts In-Stock

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1,172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 453 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

453

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,631 parts In-Stock

1+ parts

$3.500

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-

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1,631

$3.500

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One Stop Electronics

USA . 888 parts In-Stock

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$4.500

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888

$4.500

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AZTECH Wire

Italy . 870 parts In-Stock

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$7.698

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870

$7.698

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Parana Technologies

USA . 434 parts In-Stock

1+ parts

$13.247

100+ parts

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$13.751

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434

$13.247

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$13.751

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DigiPath Technology Company

USA . 843 parts In-Stock

1+ parts

$14.586

100+ parts

$13.419

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843

$14.586

$13.419

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ChromeModa Solutions

Germany . 174 parts In-Stock

1+ parts

$14.884

100+ parts

$12.205

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174

$14.884

$12.205

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IDEA Electronic Components Group

UK . 100 parts In-Stock

1+ parts

$14.884

100+ parts

$14.140

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$13.396

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100

$14.884

$14.140

$13.396

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Corphita

USA . 4,522 parts In-Stock

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4,522

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Microchip USA

USA . 1,386 parts In-Stock

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1,386

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Native Components

USA . 820 parts In-Stock

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$3.492

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820

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$3.492

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Corohmni

South Africa . 492 parts In-Stock

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492

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Northwest PG Solutions

USA . 438 parts In-Stock

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$3.528

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438

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$3.528

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Overview

Enhance your power management solutions with the BQ2010SN-D107TRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the Power Management ICs category. This small outline package offers adjustable thresholds and a wide supply voltage range, making it versatile for various applications. With a temperature grade of commercial and nickel palladium gold terminal finish, this IC ensures optimal performance in diverse environments. Experience the value and benefits that Texas Instruments brings to the table with the BQ2010SN-D107TRG4, delivering efficiency and precision to your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and low cost, making the product robust and affordable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a circuit board.

Nominal Supply Voltage (Vsup): 4.25 V

This voltage level is suitable for a wide range of applications, providing flexibility and compatibility.

Width (mm): 3.9 mm

The compact width of this product allows for space-saving designs in electronic devices.

Maximum Supply Current (Isup): 0.25 mA

Low supply current consumption helps in reducing power consumption and increasing energy efficiency.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Power Management ICs BQ2010SN-D107TRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/6.5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2010SN-D107TRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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