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AM26LV32INSG4

Texas Instruments

AM26LV32INSG4 by Texas Instruments

AM26LV32INSG4 by Texas Instruments is a 16-terminal line driver/receiver with 3.3V power supply, operating b/w -40 to 85°C. It features differential output polarity, BICMOS technology, and EIA-422-B interface standard. Ideal for industrial applications requiring reliable data transmission over short distances.

Median Price

$2.730

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 288 parts In-Stock

1+ parts

$2.730

100+ parts

$1.960

1k+ parts

$1.570

10k+ parts

$1.450

288

$2.730

$1.960

$1.570

$1.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 885 parts In-Stock

1+ parts

$2.594

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$2.594

-

-

-

Vyrian

USA . 5,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,597 parts In-Stock

1+ parts

$2.457

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

$2.457

-

-

-

Parana Technologies

USA . 310 parts In-Stock

1+ parts

$9.617

100+ parts

-

1k+ parts

$10.211

10k+ parts

-

310

$9.617

-

$10.211

-

ChromeModa Solutions

Germany . 5,993 parts In-Stock

1+ parts

$10.806

100+ parts

$8.861

1k+ parts

-

10k+ parts

-

5,993

$10.806

$8.861

-

-

IDEA Electronic Components Group

UK . 1,380 parts In-Stock

1+ parts

$10.806

100+ parts

$10.266

1k+ parts

$9.725

10k+ parts

-

1,380

$10.806

$10.266

$9.725

-

Microchip USA

USA . 1,255 parts In-Stock

1+ parts

-

100+ parts

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1,255

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-

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DigiPath Technology Company

USA . 1,046 parts In-Stock

1+ parts

-

100+ parts

$9.743

1k+ parts

-

10k+ parts

-

1,046

-

$9.743

-

-

Native Components

USA . 713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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713

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Northwest PG Solutions

USA . 576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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576

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Overview

Upgrade your communication systems with the AM26LV32INSG4 from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable line drivers & receivers that are essential for a wide range of applications. With superior performance and durability, this product offers customers value and peace of mind. Whether you're looking to enhance data transmission or improve signal integrity, the AM26LV32INSG4 is the solution you need. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product suitable for use in various environments.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, increasing compatibility with different systems.

No. of Functions: 4

Multiple functions integrated into one component, reducing the need for additional components and simplifying the circuit design.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring reliability under varying conditions.

Output Characteristics: DIFFERENTIAL

Provides enhanced noise immunity and signal integrity, making it suitable for long-distance communication.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Complies with industry standards, ensuring compatibility and interoperability with other devices.

Technical Specifications

Line Drivers & Receivers AM26LV32INSG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

5 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

17 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

AM26LV32INSG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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