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AM26LV31CNS

Texas Instruments

AM26LV31CNS by Texas Instruments

AM26LV31CNS by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 3.3V. It offers a max transmit delay of 12ns and differential output. Ideal for EIA-422-B, TIA-422-B, V.11 interfaces in commercial temperature grade applications.

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,950 parts In-Stock

1+ parts

$0.370

100+ parts

$0.360

1k+ parts

$0.360

10k+ parts

-

22,950

$0.370

$0.360

$0.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,565

-

-

-

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Digiode

USA . 3,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

3,540

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 713 parts In-Stock

1+ parts

$5.383

100+ parts

-

1k+ parts

$6.065

10k+ parts

-

713

$5.383

-

$6.065

-

DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$5.927

100+ parts

$5.453

1k+ parts

-

10k+ parts

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39

$5.927

$5.453

-

-

IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

$5.443

10k+ parts

-

997

$6.048

-

$5.443

-

ChromeModa Solutions

Germany . 206 parts In-Stock

1+ parts

$6.048

100+ parts

$4.959

1k+ parts

-

10k+ parts

-

206

$6.048

$4.959

-

-

One Stop Electronics

USA . 568 parts In-Stock

1+ parts

$7.500

100+ parts

-

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-

10k+ parts

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568

$7.500

-

-

-

Native Components

USA . 114 parts In-Stock

1+ parts

$7.693

100+ parts

-

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114

$7.693

-

-

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Component Stockers USA

USA . 5,777 parts In-Stock

1+ parts

$11.340

100+ parts

$10.780

1k+ parts

$10.440

10k+ parts

-

5,777

$11.340

$10.780

$10.440

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$18.404

100+ parts

-

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570

$18.404

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Corphita

USA . 2,443 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,443

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-

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A-Z Elektronik GmbH

Germany . 1,790 parts In-Stock

1+ parts

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1,790

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-

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Northwest PG Solutions

USA . 1,767 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$7.539

10k+ parts

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1,767

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$7.539

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Authorized Procurement Solutions

USA . 1,200 parts In-Stock

1+ parts

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1,200

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Microchip USA

USA . 979 parts In-Stock

1+ parts

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979

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Assy Fe

Spain . 192 parts In-Stock

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192

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Overview

Experience the unmatched quality and reliability of the Texas Instruments AM26LV31CNS Line Driver & Receiver. Manufactured by industry leader Texas Instruments, this product offers unparalleled performance and durability. Ideal for a wide range of applications, this line driver provides customers with exceptional value and benefits. Say goodbye to transmission delays and hello to seamless communication with the AM26LV31CNS. Trust Texas Instruments for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or applications where weight is a concern.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in different power supply setups and ensures compatibility with a wide range of systems.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast data transmission, making the product suitable for high-speed communication applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, leading to reliable connections and long-term durability.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades means this product can operate reliably in standard environmental conditions, making it suitable for a wide range of applications.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Support for multiple interface standards ensures compatibility with various communication protocols, making this product versatile and adaptable to different systems.

Technical Specifications

Line Drivers & Receivers AM26LV31CNS attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

BUILT-IN DRIVER OUTPUT SHORT CIRCUIT PROTECTION

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.95 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

AM26LV31CNS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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