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AM26LS32AMFKB

Texas Instruments

AM26LS32AMFKB by Texas Instruments

AM26LS32AMFKB by Texas Instruments is a 20-terminal chip carrier with 4 functions, operating at -55 to 125 °C. It features EIA-422-B interface standard, 5V nominal voltage, and MIL-STD-883 Class B screening level. Ideal for military-grade applications requiring true output polarity and differential Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,391 parts In-Stock

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Chip Stock

USA . 3,845 parts In-Stock

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Digiode

USA . 2,846 parts In-Stock

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Cyclops Electronics Ltd

UK . 238 parts In-Stock

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LWI Electronics Inc

India . 13 parts In-Stock

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Component Sense

UK . 5 parts In-Stock

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Electronics Depot

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Ampacity Inc.

Singapore . 1,068 parts In-Stock

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$2.500

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$2.500

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One Stop Electronics

USA . 1,247 parts In-Stock

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$3.500

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Parana Technologies

USA . 1,058 parts In-Stock

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$13.077

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$13.572

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AZTECH Wire

Italy . 521 parts In-Stock

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$14.048

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DigiPath Technology Company

USA . 182 parts In-Stock

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$14.399

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$13.247

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ChromeModa Solutions

Germany . 3,608 parts In-Stock

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$14.693

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$12.048

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IDEA Electronic Components Group

UK . 686 parts In-Stock

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$14.693

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$13.958

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$13.224

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Lixinc

USA . 7,801 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,151 parts In-Stock

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Corphita

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Microchip USA

USA . 3,572 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,434 parts In-Stock

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Authorized Procurement Solutions

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Northwest PG Solutions

USA . 1,048 parts In-Stock

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GreenTree Electronics

Israel . 238 parts In-Stock

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Kepictronics

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Native Components

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Perfect Parts

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Overview

Elevate your communication systems with the Texas Instruments AM26LS32AMFKB line driver & receiver. Crafted with precision and expertise, this high-quality product offers unparalleled reliability and performance in various applications. From industrial automation to telecommunications, this versatile component ensures seamless data transmission with its advanced technology. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing value and benefits to customers seeking top-notch quality and efficiency in their electronic designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for various operating environments.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle robust power requirements.

No. of Functions: 4

Having multiple functions in one device offers versatility and efficiency in circuit design.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows for use in extreme conditions without compromising performance.

Interface Standard: EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

Compliance with multiple interface standards ensures compatibility with a wide range of systems and devices.

Technical Specifications

Line Drivers & Receivers AM26LS32AMFKB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

AM26LS32AMFKB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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