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AM26LS32AMDREP

Texas Instruments

AM26LS32AMDREP by Texas Instruments

AM26LS32AMDREP by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at -55 to 125 °C. It has a supply voltage range of 4.5-5.5 V and supports EIA-422-B, TIA-422-B interfaces. Ideal for military-grade applications requiring high-speed data transmission with low output current of 8Amp.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,746 parts In-Stock

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8,746

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Digiode

USA . 1,041 parts In-Stock

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1,041

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Native Components

USA . 51 parts In-Stock

1+ parts

$8.960

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51

$8.960

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Parana Technologies

USA . 1,243 parts In-Stock

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$9.170

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$9.817

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1,243

$9.170

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$9.817

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AZTECH Wire

Italy . 800 parts In-Stock

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$9.309

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800

$9.309

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Northwest PG Solutions

USA . 1,599 parts In-Stock

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$9.856

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$8.870

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1,599

$9.856

$8.870

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DigiPath Technology Company

USA . 2,167 parts In-Stock

1+ parts

$10.097

100+ parts

$9.289

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2,167

$10.097

$9.289

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ChromeModa Solutions

Germany . 3,145 parts In-Stock

1+ parts

$10.303

100+ parts

$8.448

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3,145

$10.303

$8.448

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IDEA Electronic Components Group

UK . 677 parts In-Stock

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$10.303

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$9.788

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$9.273

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677

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$9.273

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One Stop Electronics

USA . 222 parts In-Stock

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$11.500

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222

$11.500

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Semicontronic

India . 1,622 parts In-Stock

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$30.500

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$29.738

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$29.585

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1,622

$30.500

$29.738

$29.585

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Ampacity Inc.

Singapore . 405 parts In-Stock

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$31.500

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Corphita

USA . 2,936 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,560 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,040 parts In-Stock

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Microchip USA

USA . 265 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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Overview

Unlock seamless communication with the AM26LS32AMDREP by Texas Instruments, a top-tier manufacturer known for delivering high-quality solutions. As a part of the Line Drivers & Receivers category, this product offers reliable performance and versatility in a compact package. Ideal for military-grade applications, this technology ensures efficient signal transmission with minimal delay, making it a valuable asset for your projects. Trust Texas Instruments to provide you with the best-in-class solutions for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the product.

Surface Mount: YES

The surface mount feature makes it easy to install and mount on a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can handle a wide range of power inputs, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and ensures efficient use of space.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage levels, making integration into existing systems seamless.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connectivity options and can support complex circuit configurations.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation even with lower power inputs, increasing reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to withstand heat and operate in challenging environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures the product can function in cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Technical Specifications

Line Drivers & Receivers AM26LS32AMDREP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AM26LS32AMDREP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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