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AM26LS31MJB

Texas Instruments

AM26LS31MJB by Texas Instruments

AM26LS31MJB by Texas Instruments is a 4-bit line driver with 3-STATE output, operating at -55 to 125 °C. It features a max supply voltage of 5.5 V and differential output for EIA-422-B, TIA-422-B, V.11 interfaces. Ideal for military-grade applications requiring fast transmission speeds with low power consumption.

Median Price

$48.173

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

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$48.173

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11

$48.173

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Nova Conductors

Japan . 82 parts In-Stock

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$35.370

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$35.370

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Digiode

USA . 3,244 parts In-Stock

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$45.764

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 1,928 parts In-Stock

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VNN

France . 450 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Parana Technologies

USA . 2,331 parts In-Stock

1+ parts

$12.637

100+ parts

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$13.098

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$12.637

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$13.098

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AZTECH Wire

Italy . 566 parts In-Stock

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$12.944

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DigiPath Technology Company

USA . 694 parts In-Stock

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$13.915

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$12.802

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694

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ChromeModa Solutions

Germany . 1,799 parts In-Stock

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$14.199

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$11.643

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$14.199

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$13.489

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$12.779

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Netroflash

USA . 50 parts In-Stock

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$35.370

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$33.601

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$32.894

50

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$32.894

Ampacity Inc.

Singapore . 11 parts In-Stock

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$40.950

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Corphita

USA . 2,068 parts In-Stock

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$43.356

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Kepictronics

USA . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,046 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic systems with the AM26LS31MJB by Texas Instruments, a high-quality line driver & receiver designed to meet MIL-STD-883 Class B standards. With its ceramic, glass-sealed package and efficient technology, this product offers reliable performance in various applications. From EIA-422-B to V.11 interface standards, this versatile component ensures seamless communication while providing a differential output and low current consumption. Trust Texas Instruments for unparalleled quality and innovation, and experience the value this product adds to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power supplies.

No. of Functions: 4

Offers versatility and flexibility in terms of signal processing capabilities.

Maximum Transmit Delay: 30 ns

Ensures fast and efficient transmission of data signals.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments.

Technical Specifications

Line Drivers & Receivers AM26LS31MJB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.305 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

30 ns

Width:

7.62 mm

Trade Compliance

AM26LS31MJB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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