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AM26LS31MFKB

Texas Instruments

AM26LS31MFKB by Texas Instruments

AM26LS31MFKB by Texas Instruments is a 4-function line driver with 30ns max transmit delay, operating at -55 to 125 °C. It features EIA-422-B, TIA-422-B, V.11 interface standard and MIL-STD-883 Class B screening level. Ideal for military-grade applications requiring differential output and 5V power supplies.

Median Price

$41.383

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$41.383

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50

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Vyrian

USA . 6,975 parts In-Stock

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VNN

France . 4,342 parts In-Stock

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Digiode

USA . 2,099 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,022 parts In-Stock

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Resion

USA . 152 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 881 parts In-Stock

1+ parts

$8.858

100+ parts

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$9.542

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881

$8.858

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$9.542

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AZTECH Wire

Italy . 861 parts In-Stock

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$9.615

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861

$9.615

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DigiPath Technology Company

USA . 1,120 parts In-Stock

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$9.754

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$8.974

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$9.754

$8.974

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ChromeModa Solutions

Germany . 2,423 parts In-Stock

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$9.953

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$8.161

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$9.953

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IDEA Electronic Components Group

UK . 936 parts In-Stock

1+ parts

$9.953

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$9.455

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$8.958

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936

$9.953

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Ampacity Inc.

Singapore . 398 parts In-Stock

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$14.500

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Continental Prestige Electronics

USA . 2,238 parts In-Stock

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$41.383

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$40.555

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$40.555

One Stop Electronics

USA . 509 parts In-Stock

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$41.500

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Kepictronics

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 5,374 parts In-Stock

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Microchip USA

USA . 3,875 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,890 parts In-Stock

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Corphita

USA . 752 parts In-Stock

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Alle Elektronik GmbH

Germany . 707 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the AM26LS31MFKB by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This line driver & receiver offers seamless connectivity and fast data transmission, making it ideal for a wide range of applications. Trust in Texas Instruments to provide you with the quality and value you deserve. Elevate your projects with the AM26LS31MFKB today.

Feature Benefit Bullets

Package Body Material

Ceramic and metal-sealed cofired package body material provides excellent durability and protection for the internal components.

Surface Mount

Surface mount capability allows for easy installation and flexibility in mounting options.

Maximum Supply Voltage

Supports a high maximum supply voltage for reliable and stable operation.

No. of Functions

Multiple functions in one device offer versatility and efficiency.

Screening Level

MIL-STD-883 Class B screening ensures high reliability and quality.

Package Shape

Square package shape offers efficient use of space and easy integration into circuit designs.

Maximum Transmit Delay

Low transmit delay ensures fast signal transmission.

Maximum Supply Voltage-1

Ensures compatibility with a high supply voltage for various applications.

Power Supplies (V)

Operating at a standard voltage level makes integration and power management easier.

No. of Terminals

Sufficient number of terminals for connecting to other components and systems.

Package Style (Meter)

Chip carrier style with heat sink/slug enhances thermal dissipation for improved performance.

Minimum Supply Voltage-1

Supports a low minimum supply voltage for energy efficiency and versatility in power sources.

Maximum High Level Input Current

Low input current requirement helps reduce power consumption.

Minimum Operating Temperature

Wide operating temperature range ensures reliable performance in various environments.

Terminal Finish

Tin lead terminal finish provides good connectivity and solderability.

Maximum Output Low Current

High output current capability for driving external loads.

Differential Output

Differential output for noise immunity and signal integrity.

Technology

Bipolar technology offers high speed and reliable performance.

Temperature Grade

Military-grade temperature range allows for operation in harsh conditions.

Maximum Supply Current

Low supply current for efficient power consumption.

Nominal Supply Voltage

Standard nominal supply voltage for compatibility with common power sources.

Terminal Pitch

Terminal pitch provides easy connectivity with standard spacing.

Driver No. of Bits

Four bits driver for handling multiple data channels efficiently.

Interface IC Type

Specifically designed as a line driver with compatibility to EIA-422-B, TIA-422-B, and V.11 interface standards.

Technical Specifications

Line Drivers & Receivers AM26LS31MFKB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

30 ns

Width:

8.89 mm

Trade Compliance

AM26LS31MFKB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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