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AM26C32MJB

Texas Instruments

AM26C32MJB by Texas Instruments

AM26C32MJB by Texas Instruments is a 4-function line driver with 16 terminals. It operates b/w -55 to 125 °C, with a max supply voltage of 5.5 V and output current of 6 Amp. Ideal for military-grade applications requiring EIA-422-B interface standard compliance.

Median Price

$29.175

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 75 parts In-Stock

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$29.175

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75

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$29.175

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Distributors (In-Stock)

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Nova Conductors

Japan . 70 parts In-Stock

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$19.000

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70

$19.000

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Vyrian

USA . 6,570 parts In-Stock

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Digiode

USA . 1,026 parts In-Stock

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VNN

France . 946 parts In-Stock

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946

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Chip Stock

USA . 805 parts In-Stock

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805

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QIE Inc.

USA . 16 parts In-Stock

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16

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A2Z Electronics, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 705 parts In-Stock

1+ parts

$11.574

100+ parts

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$11.983

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705

$11.574

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$11.983

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DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

$12.745

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$11.725

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935

$12.745

$11.725

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ChromeModa Solutions

Germany . 6,256 parts In-Stock

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$13.005

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$10.664

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$13.005

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$13.005

100+ parts

$12.355

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$11.704

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2,068

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$11.704

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AZTECH Wire

Italy . 521 parts In-Stock

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$16.497

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521

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Bastille Electronics

Australia . 500 parts In-Stock

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$19.000

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$18.050

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$16.910

500

$19.000

$18.050

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$16.910

Ampacity Inc.

Singapore . 75 parts In-Stock

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$24.800

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$24.800

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Microchip USA

USA . 2,844 parts In-Stock

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Corphita

USA . 2,088 parts In-Stock

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Overview

Experience superior performance and reliability with the AM26C32MJB by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers unmatched quality and is perfect for various applications. With its advanced technology and military-grade temperature grade, this product ensures optimal functionality even in extreme conditions. Trust Texas Instruments to deliver top-notch products that provide value, efficiency, and seamless operation. Elevate your projects with the AM26C32MJB and experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring reliable performance in harsh environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated heat levels, making it suitable for industrial applications.

Technology: BICMOS

Utilizing BiCMOS technology allows for a combination of high-speed operation with low power consumption, making this product efficient and effective for signal transmission.

Interface Standard: EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

Compliance with multiple interface standards ensures compatibility with a wide range of communication protocols, making this product versatile and easy to integrate into existing systems.

Maximum Output Low Current: 6 Amp

The high maximum output low current of 6 Amp allows for driving multiple loads efficiently, making this product suitable for applications requiring strong signal transmission capabilities.

Technical Specifications

Line Drivers & Receivers AM26C32MJB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

6 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

4

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

AM26C32MJB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-461-6097, 5962014616097

NIIN

014616097

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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