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AM26C31QDG4

Texas Instruments

AM26C31QDG4 by Texas Instruments

AM26C31QDG4 by Texas Instruments is a 16-terminal LINE DRIVER with BICMOS technology. It operates at -40 to 125 °C, with 5V supply and 3mA current. Features include 12ns max transmit delay, EIA-422-B interface standard, and differential output. Ideal for automotive applications requiring high-speed data transmission.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$2.510

100+ parts

-

1k+ parts

-

10k+ parts

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4

$2.510

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-

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Mouser Electronics

USA . 111 parts In-Stock

1+ parts

$2.820

100+ parts

-

1k+ parts

$1.740

10k+ parts

$1.570

111

$2.820

-

$1.740

$1.570

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.360

10k+ parts

$1.280

11

-

$1.520

$1.360

$1.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$1.082

100+ parts

-

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31

$1.082

-

-

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Digiode

USA . 1,099 parts In-Stock

1+ parts

$1.254

100+ parts

-

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-

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1,099

$1.254

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-

-

Chip Stock

USA . 156,852 parts In-Stock

1+ parts

-

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156,852

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-

-

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Vyrian

USA . 2,235 parts In-Stock

1+ parts

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2,235

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VNN

France . 1,067 parts In-Stock

1+ parts

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1,067

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

1+ parts

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40

-

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Holdelec - ElecDif-Pro

France . 40 parts In-Stock

1+ parts

-

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40

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

1+ parts

-

100+ parts

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30

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 45 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

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45

$1.120

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Corphita

USA . 1,410 parts In-Stock

1+ parts

$1.188

100+ parts

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1,410

$1.188

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Parana Technologies

USA . 381 parts In-Stock

1+ parts

$13.021

100+ parts

-

1k+ parts

$13.518

10k+ parts

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381

$13.021

-

$13.518

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$13.185

100+ parts

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685

$13.185

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DigiPath Technology Company

USA . 2,116 parts In-Stock

1+ parts

$14.337

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2,116

$14.337

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ChromeModa Solutions

Germany . 5,710 parts In-Stock

1+ parts

$14.630

100+ parts

$11.997

1k+ parts

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5,710

$14.630

$11.997

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IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$14.630

100+ parts

$13.898

1k+ parts

$13.167

10k+ parts

-

379

$14.630

$13.898

$13.167

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Perfect Parts

USA . 898 parts In-Stock

1+ parts

-

100+ parts

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898

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Overview

Enhance your electronic designs with the AM26C31QDG4 by Texas Instruments, a top-quality line driver and receiver that offers superior performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will meet your expectations. Ideal for applications requiring high-speed data transmission, this compact and efficient device delivers unmatched value and benefits to customers looking for a reliable solution. Upgrade your projects today with the AM26C31QDG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 4

Offers multiple functions in a single unit, providing cost-effective solutions for complex systems.

Maximum Transmit Delay: 12 ns

Provides fast signal transmission, ideal for high-speed communication requirements.

Power Supplies (V): 5

Operates on a standard power supply voltage, making it compatible with most systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Differential Output: YES

Provides improved noise immunity and signal integrity in long distance communication.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Complies with industry standards for easy integration with existing systems.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Line Drivers & Receivers AM26C31QDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

AM26C31QDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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