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AM26C31MFKB

Texas Instruments

AM26C31MFKB by Texas Instruments

AM26C31MFKB by Texas Instruments is a 4-function line driver with 5V supply, operating from -55 to 125 °C. It features BICMOS technology, EIA-422-B interface standard, and true output polarity. Ideal for military-grade applications requiring differential outputs with a max transmit delay of 12ns.

Median Price

$40.838

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2 parts In-Stock

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$40.838

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Vyrian

USA . 3,886 parts In-Stock

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Chip Stock

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Digiode

USA . 165 parts In-Stock

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Electronic Expediters

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 159 parts In-Stock

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$0.448

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$0.430

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Northwest PG Solutions

USA . 710 parts In-Stock

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$0.493

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$0.435

710

$0.493

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$0.435

Parana Technologies

USA . 440 parts In-Stock

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$7.053

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$7.592

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440

$7.053

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$7.592

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DigiPath Technology Company

USA . 59 parts In-Stock

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$7.766

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$7.145

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ChromeModa Solutions

Germany . 876 parts In-Stock

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$7.925

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$6.498

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IDEA Electronic Components Group

UK . 594 parts In-Stock

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$7.925

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$7.132

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AZTECH Wire

Italy . 694 parts In-Stock

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$15.004

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One Stop Electronics

USA . 919 parts In-Stock

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$20.500

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Ampacity Inc.

Singapore . 1,570 parts In-Stock

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$22.500

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Lixinc

USA . 12,726 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Corphita

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Perfect Parts

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Microchip USA

USA . 1,743 parts In-Stock

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Overview

Elevate your electronic designs with the AM26C31MFKB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The AM26C31MFKB falls under the Line Drivers & Receivers category, offering unmatched performance and versatility. Ideal for a wide range of applications, this product provides customers with superior value, efficiency, and precision. Trust Texas Instruments to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability, making the product suitable for various rugged environments.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for better performance and compatibility with a wider range of systems.

No. of Functions: 4

Having multiple functions in one device can save space and simplify the overall circuit design.

Maximum Transmit Delay: 12 ns

Low transmit delay ensures fast signal transmission, making the product suitable for high-speed applications.

Operating Temperature: -55 to 125 °C

Wide operating temperature range allows the product to function in extreme conditions.

Technology: BICMOS

Utilizing BiCMOS technology offers the benefits of both bipolar and CMOS, such as high speed and low power consumption.

Technical Specifications

Line Drivers & Receivers AM26C31MFKB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20000 Amp

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

4 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

12 ns

Width:

8.89 mm

Trade Compliance

AM26C31MFKB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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