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ADS7841PBG4

Texas Instruments

ADS7841PBG4 by Texas Instruments

ADS7841PBG4 by Texas Instruments is a 12-bit ADC with 4 analog input channels, 0.0244% linearity error, and 3.75us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,792 parts In-Stock

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Digiode

USA . 3,519 parts In-Stock

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3,519

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Native Components

USA . 670 parts In-Stock

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$1.690

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670

$1.690

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Northwest PG Solutions

USA . 1,782 parts In-Stock

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$1.859

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$1.859

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AZTECH Wire

Italy . 725 parts In-Stock

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$14.458

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725

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Parana Technologies

USA . 1,631 parts In-Stock

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$15.227

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$15.625

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DigiPath Technology Company

USA . 279 parts In-Stock

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$16.767

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$15.425

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279

$16.767

$15.425

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ChromeModa Solutions

Germany . 3,717 parts In-Stock

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$17.109

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$14.029

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

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$17.109

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$16.254

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$15.398

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One Stop Electronics

USA . 1,356 parts In-Stock

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$33.000

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Component Stockers USA

USA . 718 parts In-Stock

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$99.990

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Microchip USA

USA . 5,790 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unleash the power of precision with the ADS7841PBG4 by Texas Instruments, a top-of-the-line Analog-to-Digital Converter designed to deliver unparalleled accuracy in a compact package. With Texas Instruments' reputation for excellence in electronic components, this ADC offers unmatched quality and reliability. Ideal for applications where precise measurements are crucial, such as industrial automation and data acquisition systems, the ADS7841PBG4 provides customers with the value, benefits, and advantages they need to take their projects to the next level. Experience the difference with Texas Instruments - where innovation meets perfection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the ADC lightweight and durable, making it suitable for various applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows the ADC to handle multiple inputs simultaneously, making it versatile for different measurement tasks.

No. of Bits: 12

With 12 bits resolution, this ADC provides high accuracy in converting analog signals to digital data, ensuring precise measurements.

Maximum Linearity Error (EL): 0.0244 %

The low maximum linearity error percentage indicates the ADC's high level of accuracy and consistency in converting analog signals.

Power Supplies (V): 2.7/5

Operating with a range of 2.7V to 5V power supplies, this ADC can be easily integrated into different systems without requiring specific voltage levels.

Maximum Conversion Time: 3.75 us

The fast maximum conversion time of 3.75 microseconds ensures real-time data acquisition, making this ADC suitable for time-sensitive applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range of -40°C to 85°C, this ADC is reliable and stable in harsh environmental conditions, increasing its suitability for industrial use.

Technical Specifications

Analog-to-Digital Converters ADS7841PBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.75 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.76 in (19.305 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP16,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7841PBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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