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ADS7827IDRBRG4

Texas Instruments

ADS7827IDRBRG4 by Texas Instruments

The Texas Instruments ADS7827IDRBRG4 is an 8-bit ADC with a max linearity error of 0.3906%. Operating at 2.7V, it offers a sample rate of 0.25 MHz and features a CMOS technology for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,500 parts In-Stock

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Vyrian

USA . 7,031 parts In-Stock

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7,031

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$10.389

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560

$10.389

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Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

$12.258

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$12.681

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1,226

$12.258

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$12.681

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DigiPath Technology Company

USA . 2,188 parts In-Stock

1+ parts

$13.498

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$12.418

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$13.498

$12.418

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IDEA Electronic Components Group

UK . 1,964 parts In-Stock

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$13.773

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$13.084

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$12.396

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1,964

$13.773

$13.084

$12.396

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ChromeModa Solutions

Germany . 344 parts In-Stock

1+ parts

$13.773

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$11.294

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344

$13.773

$11.294

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One Stop Electronics

USA . 1,386 parts In-Stock

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$22.000

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$22.000

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Native Components

USA . 598 parts In-Stock

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$92.050

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$88.368

598

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$88.368

Component Stockers USA

USA . 629 parts In-Stock

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$99.990

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629

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Northwest PG Solutions

USA . 1,324 parts In-Stock

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$101.255

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A-Z Elektronik GmbH

Germany . 6,810 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,540 parts In-Stock

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Corphita

USA . 2,288 parts In-Stock

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Microchip USA

USA . 1,418 parts In-Stock

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1,418

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Overview

Discover the Texas Instruments ADS7827IDRBRG4 Analog-to-Digital Converter, a cutting-edge solution for precise data conversion in industrial applications. With its high quality and reliability, Texas Instruments ensures top-notch performance and accuracy. This versatile ADC is ideal for a wide range of applications, offering customers value by providing fast conversion times and low power consumption. Enhance your projects with the ADS7827IDRBRG4 and experience the benefits of superior analog-to-digital conversion technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards.

No. of Bits: 8

Offers a decent resolution for analog-to-digital conversion.

Maximum Linearity Error (EL): 0.3906%

Ensures accurate conversion of analog signals to digital.

Power Supplies (V): 2.7

Optimal voltage for operation.

No. of Terminals: 8

Provides necessary connections for input and output signals.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Enables efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 2.7 V

Ensures proper functionality at lower voltage levels.

Maximum Operating Temperature: 85 °C

Allows for operation in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance for terminals.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes accurate conversion method for reliable results.

Technical Specifications

Analog-to-Digital Converters ADS7827IDRBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.66 µs

Electrical Specifications

Power Supplies:

2.7 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

SOLCC8,.12,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7827IDRBRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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