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ADS7826IDRBRG4

Texas Instruments

ADS7826IDRBRG4 by Texas Instruments

Texas Instruments ADS7826IDRBRG4 is a 10-bit ADC with 0.0977% EL, 2.7V supplies, and 0.2 MHz sample rate. Ideal for industrial applications requiring fast conversion times and precise analog-to-digital conversion in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,395 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,395

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Digiode

USA . 835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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835

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,297 parts In-Stock

1+ parts

$15.335

100+ parts

-

1k+ parts

$15.728

10k+ parts

-

2,297

$15.335

-

$15.728

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DigiPath Technology Company

USA . 1,994 parts In-Stock

1+ parts

$16.885

100+ parts

$15.535

1k+ parts

-

10k+ parts

-

1,994

$16.885

$15.535

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ChromeModa Solutions

Germany . 2,460 parts In-Stock

1+ parts

$17.230

100+ parts

$14.129

1k+ parts

-

10k+ parts

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2,460

$17.230

$14.129

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IDEA Electronic Components Group

UK . 202 parts In-Stock

1+ parts

$17.230

100+ parts

$16.368

1k+ parts

$15.507

10k+ parts

-

202

$17.230

$16.368

$15.507

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AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$17.572

100+ parts

-

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10k+ parts

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534

$17.572

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One Stop Electronics

USA . 965 parts In-Stock

1+ parts

$31.000

100+ parts

-

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965

$31.000

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Native Components

USA . 919 parts In-Stock

1+ parts

$70.670

100+ parts

-

1k+ parts

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10k+ parts

$67.843

919

$70.670

-

-

$67.843

Northwest PG Solutions

USA . 1,926 parts In-Stock

1+ parts

$77.737

100+ parts

-

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1,926

$77.737

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Corphita

USA . 4,846 parts In-Stock

1+ parts

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100+ parts

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4,846

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Microchip USA

USA . 1,437 parts In-Stock

1+ parts

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100+ parts

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1,437

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Overview

Elevate your analog-to-digital conversion experience with the ADS7826IDRBRG4 by Texas Instruments. Crafted with precision and reliability, this device offers unparalleled quality and performance in a compact package. Ideal for a wide range of applications, this ADC provides fast and accurate conversions, making it a valuable asset for any project. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade your designs with the ADS7826IDRBRG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the converter.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and making the assembly process more efficient.

No. of Bits: 10

Offers precision and accuracy in converting analog signals to digital format.

Power Supplies (V): 2.7

Operates at a low voltage, making it energy efficient.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Sample Rate: 0.2 MHz

Provides fast sampling of analog signals, ensuring accurate digitization.

Output Format: SERIAL

Allows for easy interfacing with other digital systems and devices.

Technical Specifications

Analog-to-Digital Converters ADS7826IDRBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.57 µs

Electrical Specifications

Power Supplies:

2.7 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

SOLCC8,.12,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7826IDRBRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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