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ADS7825PG4

Texas Instruments

ADS7825PG4 by Texas Instruments

ADS7825PG4 by Texas Instruments is a 16-bit ADC with 4 analog input channels, 0.0046% linearity error, and 20us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,571 parts In-Stock

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Digiode

USA . 858 parts In-Stock

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858

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One Stop Electronics

USA . 426 parts In-Stock

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$2.000

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426

$2.000

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AZTECH Wire

Italy . 325 parts In-Stock

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$13.772

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325

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Parana Technologies

USA . 755 parts In-Stock

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$18.295

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$18.429

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755

$18.295

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$18.429

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ChromeModa Solutions

Germany . 4,089 parts In-Stock

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$20.556

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$16.856

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4,089

$20.556

$16.856

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IDEA Electronic Components Group

UK . 1,586 parts In-Stock

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$20.556

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$19.528

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$18.500

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1,586

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Component Stockers USA

USA . 698 parts In-Stock

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$99.990

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$99.990

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Native Components

USA . 62 parts In-Stock

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$401.710

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$393.676

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$389.659

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$385.642

62

$401.710

$393.676

$389.659

$385.642

Northwest PG Solutions

USA . 382 parts In-Stock

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$441.881

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382

$441.881

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Corphita

USA . 2,765 parts In-Stock

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DigiPath Technology Company

USA . 1,304 parts In-Stock

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$18.533

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Microchip USA

USA . 464 parts In-Stock

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Overview

Experience the unmatched precision and reliability of Texas Instruments with the ADS7825PG4 Analog-to-Digital Converter. This innovative product offers exceptional performance in a compact package, making it ideal for a wide range of applications. Whether you're designing industrial automation systems or advanced medical devices, this converter will deliver accurate results every time. Trust in the quality and expertise of Texas Instruments to enhance your projects and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for more versatile and complex measurements to be taken simultaneously, increasing the product's flexibility.

No. of Bits: 16

With 16 bits of resolution, this ADC can provide high accuracy and precision in converting analog signals to digital format, making it suitable for demanding applications.

Maximum Linearity Error (EL): 0.0046 %

The low linearity error ensures that the converted digital output closely matches the input analog signal, leading to accurate and reliable measurements.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration and compatibility with existing systems, making it convenient for users.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the ADC to perform consistently in various environmental conditions, ensuring reliable operation.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and excellent noise immunity, making the product efficient and reliable for data conversion.

Technical Specifications

Analog-to-Digital Converters ADS7825PG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial, Parallel, 8 Bits

Maximum Linearity Error (EL):

0.0046 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.405 in (35.69 mm)

Maximum Seated Height:

0.19 in (4.83 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7825PG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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