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ADS7825PBG4

Texas Instruments

ADS7825PBG4 by Texas Instruments

The Texas Instruments ADS7825PBG4 is a 16-bit ADC with 4 analog input channels, 0.0031% linearity error, and 20us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C. Package style: IN-LINE, Technology: CMOS, Output format: SERIAL/PARALLEL/8BITS.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,562 parts In-Stock

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Digiode

USA . 81 parts In-Stock

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81

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Distributors (Availability)

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Parana Technologies

USA . 947 parts In-Stock

1+ parts

$7.933

100+ parts

-

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$8.495

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947

$7.933

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$8.495

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DigiPath Technology Company

USA . 1,126 parts In-Stock

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$8.736

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$8.037

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$8.736

$8.037

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ChromeModa Solutions

Germany . 1,336 parts In-Stock

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$8.914

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$7.309

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$8.914

$7.309

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IDEA Electronic Components Group

UK . 613 parts In-Stock

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$8.914

100+ parts

$8.468

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$8.023

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613

$8.914

$8.468

$8.023

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AZTECH Wire

Italy . 652 parts In-Stock

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$17.840

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$17.840

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One Stop Electronics

USA . 255 parts In-Stock

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$18.000

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$18.000

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Native Components

USA . 154 parts In-Stock

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$874.330

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$856.843

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$848.100

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$839.357

154

$874.330

$856.843

$848.100

$839.357

Northwest PG Solutions

USA . 2,330 parts In-Stock

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$961.763

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$961.763

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Corphita

USA . 3,607 parts In-Stock

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Microchip USA

USA . 120 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your analog data with the ADS7825PBG4 by Texas Instruments. This high-quality Analog-to-Digital Converter offers unparalleled precision and reliability, thanks to the expertise of its manufacturer. With applications in industrial settings and beyond, this product ensures accurate conversion and seamless integration into your systems. Experience the value and benefits of superior performance with the ADS7825PBG4 - a game-changer for your digital processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures easy handling and protection of internal components.

No. of Analog In Channels: 4

Allows for multiple input channels, increasing versatility and flexibility in data acquisition.

No. of Bits: 16

Higher number of bits provides better resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0031 %

Low linearity error ensures accurate conversion of analog signals with minimal distortion.

Power Supplies (V): 5

Operates on a standard power supply voltage, making it compatible with common power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature allows for accurate sampling of analog signals at a specific instance, ensuring precise digital conversion.

Technical Specifications

Analog-to-Digital Converters ADS7825PBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial, Parallel, 8 Bits

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.405 in (35.69 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.3

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7825PBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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