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ADS774KPG4

Texas Instruments

ADS774KPG4 by Texas Instruments

ADS774KPG4 by Texas Instruments is a 12-bit ADC with 0.0122% linearity error, operating at 5V. It features a sample rate of 0.117 MHz and supports binary/offset binary output codes. Ideal for industrial applications requiring precise analog-to-digital conversion within the -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,070 parts In-Stock

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Digiode

USA . 4,339 parts In-Stock

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4,339

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One Stop Electronics

USA . 569 parts In-Stock

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$1.000

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569

$1.000

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Native Components

USA . 373 parts In-Stock

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$6.271

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373

$6.271

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Parana Technologies

USA . 2,200 parts In-Stock

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$14.910

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$15.334

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$14.910

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$15.334

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DigiPath Technology Company

USA . 624 parts In-Stock

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$16.418

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624

$16.418

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ChromeModa Solutions

Germany . 2,032 parts In-Stock

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$16.753

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$13.737

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$16.753

$13.737

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IDEA Electronic Components Group

UK . 783 parts In-Stock

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$16.753

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$15.915

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$15.078

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783

$16.753

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$15.078

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AZTECH Wire

Italy . 664 parts In-Stock

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$18.572

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$18.572

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Corohmni

South Africa . 239 parts In-Stock

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$19.384

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239

$19.384

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Component Stockers USA

USA . 485 parts In-Stock

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$99.990

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Corphita

USA . 4,525 parts In-Stock

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Northwest PG Solutions

USA . 2,086 parts In-Stock

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$6.145

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Microchip USA

USA . 425 parts In-Stock

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Perfect Parts

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Overview

Elevate your analog-to-digital conversion experience with the Texas Instruments ADS774KPG4. Crafted with precision and expertise, this ADC boasts unparalleled quality and reliability that only TI can deliver. Perfect for a wide range of applications, this converter offers seamless integration and exceptional performance. Experience the value of superior technology with the ADS774KPG4 and unlock a world of possibilities for your projects. Trust in Texas Instruments to provide you with the best-in-class solutions for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

No. of Bits: 12

High resolution for accurate digital conversion.

Maximum Linearity Error (EL): 0.0122 %

High accuracy in converting analog signals to digital data.

Power Supplies (V): 5,5/-15

Supports both positive and negative power supplies for flexibility.

Maximum Conversion Time: 8.5 us

Fast conversion time allows for quick processing of analog inputs.

Technical Specifications

Analog-to-Digital Converters ADS774KPG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0122 %

Sample Rate:

117 kHz

Hold Mode:

Sample

Maximum Conversion Time:

8.5 µs

Electrical Specifications

Power Supplies:

5,5/-15 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS774KPG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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