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ADS5553IPFPR

Texas Instruments

ADS5553IPFPR by Texas Instruments

The Texas Instruments ADS5553IPFPR is a 14-bit ADC with 2 analog input channels, operating at a sample rate of 65 MHz. It features a max linearity error of 0.0244%, suitable for industrial applications requiring precise analog-to-digital conversion in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,922 parts In-Stock

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Bristol Electronics

USA . 885 parts In-Stock

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Digiode

USA . 246 parts In-Stock

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246

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Distributors (Availability)

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Native Components

USA . 555 parts In-Stock

1+ parts

$0.539

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555

$0.539

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Northwest PG Solutions

USA . 1,594 parts In-Stock

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$0.592

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1,594

$0.592

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AZTECH Wire

Italy . 218 parts In-Stock

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$7.636

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$7.636

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Parana Technologies

USA . 1,146 parts In-Stock

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$8.498

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$9.152

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$8.498

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DigiPath Technology Company

USA . 1,534 parts In-Stock

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$9.357

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$8.608

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1,534

$9.357

$8.608

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ChromeModa Solutions

Germany . 1,731 parts In-Stock

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$9.548

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$7.829

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$9.548

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IDEA Electronic Components Group

UK . 150 parts In-Stock

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$9.548

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$9.071

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$8.593

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150

$9.548

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$8.593

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One Stop Electronics

USA . 1,047 parts In-Stock

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$35.000

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Component Stockers USA

USA . 269 parts In-Stock

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$99.990

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Microchip USA

USA . 4,242 parts In-Stock

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Kepictronics

USA . 2,003 parts In-Stock

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Corphita

USA . 553 parts In-Stock

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Overview

Discover the cutting-edge ADS5553IPFPR Analog-to-Digital Converter by Texas Instruments, setting new standards in precision and performance. Designed with high-quality materials and advanced technology, this versatile device offers exceptional accuracy in a wide range of industrial applications. With dual input channels and a fast 65 MHz sample rate, the ADS5553IPFPR provides reliable data conversion with minimal error, ensuring optimal results every time. Trust Texas Instruments to deliver superior solutions that exceed expectations and drive success in your projects. Upgrade to the ADS5553IPFPR for unparalleled value and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the package, making it suitable for industrial applications.

No. of Analog In Channels: 2

Having 2 Analog In Channels allows for greater flexibility in the types of signals that can be processed simultaneously.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Bits: 14

With 14 bits resolution, this ADC can provide high accuracy in converting analog signals to digital, suitable for precision measurement applications.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures accurate signal conversion without distortion, providing reliable and precise data output.

Power Supplies (V): 3.3

Operating at 3.3V power supply makes it compatible with common voltage standards, ensuring seamless integration into existing systems.

No. of Terminals: 80

Having 80 terminals allows for versatile connections and signal processing capabilities, enabling complex data acquisition tasks.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The multiple package styles provide flexibility in choosing the right form factor for different design requirements and constraints.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85°C ensures reliable performance in harsh environments and industrial settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this ADC can withstand extreme cold conditions, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold finish on terminals enhances conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Maximum Analog Input Voltage: 2.3 V

Supporting up to 2.3V analog input voltage allows for a wide range of signal levels to be accurately converted to digital data.

Sample Rate: 65 MHz

With a high sample rate of 65 MHz, this ADC can capture fast-changing signals with precision and accuracy, making it suitable for dynamic applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC energy-efficient and reliable in noisy environments.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary method in the ADC design ensures optimized performance and unique features, setting it apart from standard converters.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with common power sources, enhancing ease of integration and deployment.

Output Bit Code: 2'S COMPLEMENT BINARY

The 2's complement binary output bit code provides a standardized format for digital data representation, facilitating data processing and analysis.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for compact and efficient PCB layout, reducing interconnect distances and improving signal integrity.

Minimum Analog Input Voltage: 0 V

Supporting an input voltage as low as 0V enables accurate conversion of zero-level signals, improving sensitivity and dynamic range.

Output Format: PARALLEL, WORD

The parallel word output format allows for easy interfacing with external devices and processors, enabling seamless data transfer and analysis.

Sample and Hold/Track and Hold: SAMPLE

Using sample-and-hold methodology ensures accurate capturing and conversion of analog signals at precise moments, minimizing signal distortion.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this ADC can withstand moderate exposure to moisture during assembly and operation, ensuring long-term reliability.

Technical Specifications

Analog-to-Digital Converters ADS5553IPFPR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

80

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP80,.55SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G80

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5553IPFPR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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