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ADS5541IPAPR

Texas Instruments

ADS5541IPAPR by Texas Instruments

Texas Instruments ADS5541IPAPR is a 14-bit ADC with 105 MHz sample rate, 0.0305% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact square package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,688 parts In-Stock

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5,688

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Digiode

USA . 2,885 parts In-Stock

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2,885

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SPM Sales

USA . 34 parts In-Stock

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34

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Distributors (Availability)

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One Stop Electronics

USA . 921 parts In-Stock

1+ parts

$4.000

100+ parts

-

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921

$4.000

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AZTECH Wire

Italy . 892 parts In-Stock

1+ parts

$8.859

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892

$8.859

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Parana Technologies

USA . 402 parts In-Stock

1+ parts

$18.933

100+ parts

-

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$19.002

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402

$18.933

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$19.002

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ChromeModa Solutions

Germany . 4,277 parts In-Stock

1+ parts

$21.273

100+ parts

$17.444

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4,277

$21.273

$17.444

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IDEA Electronic Components Group

UK . 1,339 parts In-Stock

1+ parts

$21.273

100+ parts

$20.209

1k+ parts

$19.146

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1,339

$21.273

$20.209

$19.146

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Native Components

USA . 196 parts In-Stock

1+ parts

$1,731.130

100+ parts

$1,696.507

1k+ parts

$1,679.196

10k+ parts

$1,661.885

196

$1,731.130

$1,696.507

$1,679.196

$1,661.885

Northwest PG Solutions

USA . 2,268 parts In-Stock

1+ parts

$1,904.243

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2,268

$1,904.243

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DigiPath Technology Company

USA . 1,541 parts In-Stock

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$19.180

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1,541

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$19.180

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Corphita

USA . 299 parts In-Stock

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299

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Microchip USA

USA . 105 parts In-Stock

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105

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Overview

Unlock the potential of your analog-to-digital conversion needs with the ADS5541IPAPR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliability and performance. This ADC offers a sample rate of 105 MHz and a maximum analog input voltage of 2.3V, making it ideal for industrial applications. With its compact design and advanced technology, this converter provides accurate results and efficient operation. Trust Texas Instruments to provide you with the cutting-edge solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 14

Higher number of bits results in higher resolution and better accuracy in the conversion process.

Power Supplies (V): 3.3

The 3.3V power supply allows for compatibility with a wide range of electronic devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising functionality.

Sample Rate: 105 MHz

The high sample rate ensures fast and accurate conversion of analog signals, making this product ideal for real-time applications.

Technical Specifications

Analog-to-Digital Converters ADS5541IPAPR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5541IPAPR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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