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ADS5525IRGZ25

Texas Instruments

ADS5525IRGZ25 by Texas Instruments

ADS5525IRGZ25 by Texas Instruments is a 12-bit ADC with 170 MHz sample rate and 0.0391% max linearity error. It operates at 3.3V, suitable for industrial applications requiring high-speed data conversion. The chip carrier package with a very thin profile makes it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,951 parts In-Stock

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5,951

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Digiode

USA . 900 parts In-Stock

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 538 parts In-Stock

1+ parts

$7.035

100+ parts

-

1k+ parts

$7.581

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538

$7.035

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$7.581

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DigiPath Technology Company

USA . 1,118 parts In-Stock

1+ parts

$7.746

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1,118

$7.746

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ChromeModa Solutions

Germany . 3,743 parts In-Stock

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$7.904

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$6.481

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3,743

$7.904

$6.481

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IDEA Electronic Components Group

UK . 751 parts In-Stock

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$7.904

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$7.114

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751

$7.904

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$7.114

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AZTECH Wire

Italy . 562 parts In-Stock

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$14.676

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562

$14.676

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Native Components

USA . 385 parts In-Stock

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$19.941

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385

$19.941

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Northwest PG Solutions

USA . 1,688 parts In-Stock

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$21.935

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$19.742

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$21.935

$19.742

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One Stop Electronics

USA . 407 parts In-Stock

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$24.000

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407

$24.000

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Component Stockers USA

USA . 468 parts In-Stock

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$99.990

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468

$99.990

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Microchip USA

USA . 2,378 parts In-Stock

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Corphita

USA . 291 parts In-Stock

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Overview

Elevate your analog-to-digital conversion game with the ADS5525IRGZ25 by Texas Instruments. Crafted with precision and expertise, this converter offers unparalleled quality and reliability. Perfect for a wide range of applications, this ADC opens up possibilities for precision measurement, industrial automation, and more. With Texas Instruments at the helm, you can trust that you're getting a top-notch product that delivers on its promises. Experience the value and benefits of the ADS5525IRGZ25 today and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

No. of Bits: 12

With 12 bits, this ADC can provide higher resolution and accuracy in converting analog signals to digital, making it ideal for precision measurement applications.

Maximum Linearity Error (EL): 0.0391 %

The low linearity error ensures that the digital output closely matches the input analog signal, resulting in accurate conversion and reliable performance.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V, this ADC can be easily integrated into existing electronic systems without the need for additional power conversion circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this ADC can withstand harsh environmental conditions and maintain stable performance in industrial settings.

Sample Rate: 170 MHz

The high sample rate of 170MHz allows for fast and efficient conversion of analog signals to digital data, making this ADC suitable for high-speed applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making this ADC energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Analog-to-Digital Converters ADS5525IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0391 %

Sample Rate:

170 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5525IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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