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ADS5485IRGCR

Texas Instruments

ADS5485IRGCR by Texas Instruments

The Texas Instruments ADS5485IRGCR is a 16-bit ADC with 200 MHz sample rate, 0.0153% linearity error, and 3V max analog input voltage. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,222 parts In-Stock

1+ parts

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5,222

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Digiode

USA . 3,661 parts In-Stock

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3,661

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 549 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

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10k+ parts

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549

$1.044

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Northwest PG Solutions

USA . 1,444 parts In-Stock

1+ parts

$1.149

100+ parts

-

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1,444

$1.149

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Parana Technologies

USA . 2,337 parts In-Stock

1+ parts

$7.361

100+ parts

-

1k+ parts

$7.855

10k+ parts

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2,337

$7.361

-

$7.855

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DigiPath Technology Company

USA . 1,857 parts In-Stock

1+ parts

$8.106

100+ parts

$7.457

1k+ parts

-

10k+ parts

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1,857

$8.106

$7.457

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ChromeModa Solutions

Germany . 5,757 parts In-Stock

1+ parts

$8.271

100+ parts

$6.782

1k+ parts

-

10k+ parts

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5,757

$8.271

$6.782

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$8.271

100+ parts

-

1k+ parts

$7.444

10k+ parts

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2,300

$8.271

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$7.444

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AZTECH Wire

Italy . 759 parts In-Stock

1+ parts

$10.688

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759

$10.688

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One Stop Electronics

USA . 668 parts In-Stock

1+ parts

$22.000

100+ parts

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668

$22.000

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Microchip USA

USA . 2,032 parts In-Stock

1+ parts

$160.070

100+ parts

$155.800

1k+ parts

$153.670

10k+ parts

$151.530

2,032

$160.070

$155.800

$153.670

$151.530

Corphita

USA . 3,979 parts In-Stock

1+ parts

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3,979

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Component Stockers USA

USA . 21 parts In-Stock

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21

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Overview

Unlock the power of precision with the ADS5485IRGCR by Texas Instruments, a leading name in Analog-to-Digital Converters. This top-of-the-line converter boasts unmatched quality and reliability, making it ideal for a wide range of applications. From industrial automation to medical devices, this versatile chip carrier delivers exceptional performance with minimal linearity error. Trust Texas Instruments to provide cutting-edge technology that ensures your project's success. Experience the difference with the ADS5485IRGCR - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product suitable for various environments.

No. of Bits: 16

With 16 bits, this ADC offers higher resolution and accuracy in converting analog signals to digital format.

Maximum Linearity Error (EL): 0.0153 %

The low maximum linearity error ensures precise conversion of analog signals, leading to accurate digital outputs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this ADC to function reliably in a wide range of temperature conditions.

Sample Rate: 200 MHz

With a high sample rate of 200 MHz, this ADC can effectively capture and convert fast-changing analog signals with accuracy.

Technical Specifications

Analog-to-Digital Converters ADS5485IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0153 %

Sample Rate:

200 MHz

Hold Mode:

Track

Electrical Specifications

Minimum Analog Input Voltage:

-3 V

Maximum Analog Input Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5485IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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