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ADS5482IRGC25

Texas Instruments

ADS5482IRGC25 by Texas Instruments

Texas Instruments' ADS5482IRGC25 is a 16-bit ADC with 0.0153% EL, operating at 105 MHz. Ideal for industrial applications, it offers a sample rate of 105 Msps and supports input voltages from 0-3V. With a compact square package and quad terminal position, it ensures precise analog-to-digital conversion in tight spaces.

Median Price

$87.908

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$78.140

1k+ parts

$69.910

10k+ parts

$65.800

25

-

$78.140

$69.910

$65.800

DigiKey

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Verical

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$97.675

1k+ parts

$87.388

10k+ parts

$82.250

25

-

$97.675

$87.388

$82.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,961 parts In-Stock

1+ parts

$82.488

100+ parts

-

1k+ parts

-

10k+ parts

-

4,961

$82.488

-

-

-

DigiKey Marketplace

USA . 25 parts In-Stock

1+ parts

$90.300

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$90.300

-

-

-

Vyrian

USA . 5,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,367

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 128 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

$0.271

128

$0.282

-

-

$0.271

Northwest PG Solutions

USA . 1,245 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

-

10k+ parts

$0.274

1,245

$0.310

-

-

$0.274

Parana Technologies

USA . 637 parts In-Stock

1+ parts

$4.527

100+ parts

-

1k+ parts

$4.973

10k+ parts

-

637

$4.527

-

$4.973

-

DigiPath Technology Company

USA . 505 parts In-Stock

1+ parts

$4.985

100+ parts

-

1k+ parts

-

10k+ parts

-

505

$4.985

-

-

-

ChromeModa Solutions

Germany . 2,328 parts In-Stock

1+ parts

$5.087

100+ parts

$4.171

1k+ parts

-

10k+ parts

-

2,328

$5.087

$4.171

-

-

IDEA Electronic Components Group

UK . 1,629 parts In-Stock

1+ parts

$5.087

100+ parts

-

1k+ parts

$4.578

10k+ parts

-

1,629

$5.087

-

$4.578

-

Corphita

USA . 1,804 parts In-Stock

1+ parts

$78.147

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$78.147

-

-

-

Vigor

Singapore . 1,974 parts In-Stock

1+ parts

$83.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$83.350

-

-

-

Microchip USA

USA . 207 parts In-Stock

1+ parts

$134.190

100+ parts

$131.860

1k+ parts

$130.690

10k+ parts

$129.530

207

$134.190

$131.860

$130.690

$129.530

Overview

Experience top-notch quality and precision with the Texas Instruments ADS5482IRGC25 Analog-to-Digital Converter. This innovative product boasts a cutting-edge design and unparalleled performance, making it ideal for a wide range of applications in industries such as telecommunications, industrial automation, and medical devices. With its advanced technology and reliable manufacturing by Texas Instruments, you can trust that this converter will deliver exceptional results every time. Upgrade your system today and unlock the countless benefits and advantages that the ADS5482IRGC25 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes installation easy and convenient, saving time and effort during assembly.

No. of Bits: 16

With a high number of bits, this ADC offers high resolution and accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.0153 %

The low maximum linearity error ensures precision in the conversion process and accurate representation of analog signals.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in different operating environments.

No. of Terminals: 64

Having a high number of terminals provides a wide range of connectivity options and versatility in system integration.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offers adaptability to different design requirements and thermal management needs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures performance reliability even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: QUAD

The quad terminal position offers ease of connectivity and integration into circuitry, simplifying installation.

Maximum Seated Height: 1 mm

The low maximum seated height provides space-saving benefits in compact electronic designs.

Width: 9 mm

The compact width of the product allows for efficient use of board space and integration in tight layouts.

Length: 9 mm

The compact length of the product contributes to space-saving in electronic assemblies and compact designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial conditions.

Maximum Analog Input Voltage: 3 V

Support for a high maximum analog input voltage allows for compatibility with a wide range of analog signal sources.

Sample Rate: 105 MHz

The high sample rate enables fast and accurate conversion of analog signals, making it suitable for real-time applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise in the conversion process, ensuring accurate digital data output.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly and reduces the risk of common soldering issues associated with leaded components.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary method in the ADC conversion process offers unique advantages and optimized performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable power to the ADC for consistent performance and reliable data conversion.

Output Bit Code: OFFSET BINARY

The output bit code format offers flexibility in data interpretation and processing, enhancing compatibility with different systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on PCBs, maximizing space utilization and integration efficiency.

Minimum Analog Input Voltage: 0 V

Support for a low minimum analog input voltage ensures compatibility with a wide range of analog signal sources, including zero voltage signals.

Output Format: PARALLEL, WORD

The parallel word output format simplifies data transmission and processing, enhancing system compatibility and ease of use.

Sample and Hold/Track and Hold: TRACK

The track and hold feature ensures precise capturing and conversion of analog signals at high speeds, suitable for real-time applications.

Technical Specifications

Analog-to-Digital Converters ADS5482IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0153 %

Sample Rate:

105 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

Trade Compliance

ADS5482IRGC25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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