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ADS5463MPFPEP

Texas Instruments

ADS5463MPFPEP by Texas Instruments

ADS5463MPFPEP by Texas Instruments is a 12-bit ADC with 500 MHz sample rate and 0.061% linearity error. Ideal for military applications, it operates b/w -55 to 125 °C, with supply voltages of 3.3V and 5V. The package style includes flatpack, heat sink/slug, thin profile, fine pitch in a square shape.

Median Price

$410.275

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,286 parts In-Stock

1+ parts

$259.631

100+ parts

$235.011

1k+ parts

$223.820

10k+ parts

-

1,286

$259.631

$235.011

$223.820

-

Rochester

USA . 8 parts In-Stock

1+ parts

$364.690

100+ parts

$342.810

1k+ parts

$320.930

10k+ parts

-

8

$364.690

$342.810

$320.930

-

DigiKey

USA . 8 parts In-Stock

1+ parts

$455.860

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$455.860

-

-

-

Verical

USA . 8 parts In-Stock

1+ parts

$455.863

100+ parts

$428.512

1k+ parts

$401.163

10k+ parts

-

8

$455.863

$428.512

$401.163

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 828 parts In-Stock

1+ parts

$246.649

100+ parts

-

1k+ parts

-

10k+ parts

-

828

$246.649

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$272.010

100+ parts

-

1k+ parts

-

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-

50

$272.010

-

-

-

Vyrian

USA . 3,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,953

-

-

-

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VNN

France . 1,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,656

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 374 parts In-Stock

1+ parts

$10.736

100+ parts

-

1k+ parts

$11.220

10k+ parts

-

374

$10.736

-

$11.220

-

ChromeModa Solutions

Germany . 2,903 parts In-Stock

1+ parts

$12.063

100+ parts

$9.892

1k+ parts

-

10k+ parts

-

2,903

$12.063

$9.892

-

-

IDEA Electronic Components Group

UK . 98 parts In-Stock

1+ parts

$12.063

100+ parts

$11.460

1k+ parts

$10.857

10k+ parts

-

98

$12.063

$11.460

$10.857

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Ampacity Inc.

Singapore . 229 parts In-Stock

1+ parts

$220.690

100+ parts

-

1k+ parts

-

10k+ parts

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229

$220.690

-

-

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Corphita

USA . 2,518 parts In-Stock

1+ parts

$233.668

100+ parts

-

1k+ parts

-

10k+ parts

-

2,518

$233.668

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$272.010

100+ parts

$266.570

1k+ parts

-

10k+ parts

-

1,000

$272.010

$266.570

-

-

DigiPath Technology Company

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

$10.876

1k+ parts

-

10k+ parts

-

2,071

-

$10.876

-

-

Kepictronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

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-

-

Overview

Experience the unparalleled precision and reliability of the ADS5463MPFPEP Analog-to-Digital Converter by Texas Instruments. Designed with cutting-edge technology, this converter delivers exceptional performance in a wide range of applications. From industrial automation to medical imaging, this versatile device offers customers unmatched value and quality. Trust in Texas Instruments' reputation for excellence and elevate your projects with the ADS5463MPFPEP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

No. of Bits: 12

12-bit resolution provides high precision and accuracy in converting analog signals to digital, making it suitable for applications that require fine measurements.

Maximum Linearity Error (EL): 0.061 %

Low linearity error ensures accurate conversion of analog signals to digital without distortion or loss of information.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles provide options for different mounting and cooling requirements, allowing for customization in different system designs.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in harsh environmental conditions, making it suitable for demanding applications.

Sample Rate: 500 MHz

High sample rate allows for fast and accurate conversion of analog signals to digital, making it suitable for high-speed data acquisition applications.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in signal conversion, making it suitable for high-performance applications that require stable and reliable operation.

Technical Specifications

Analog-to-Digital Converters ADS5463MPFPEP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

500 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.2 V

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

365 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

80

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP80,.55SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G80

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5463MPFPEP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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