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ADS5463IPFPR

Texas Instruments

ADS5463IPFPR by Texas Instruments

ADS5463IPFPR by Texas Instruments is a 12-bit ADC with 500 MHz sample rate, 0.061% linearity error, and 330 mA max supply current. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact square package. Operates b/w -40 to 85°C with nickel palladium gold finish and GULL WING terminals.

Median Price

$188.223

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,170 parts In-Stock

1+ parts

$188.223

100+ parts

$170.374

1k+ parts

$162.261

10k+ parts

-

4,170

$188.223

$170.374

$162.261

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,754 parts In-Stock

1+ parts

$178.812

100+ parts

-

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4,754

$178.812

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Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$189.034

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-

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53

$189.034

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Vyrian

USA . 6,438 parts In-Stock

1+ parts

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6,438

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Chip Stock

USA . 145 parts In-Stock

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145

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VNN

France . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$11.210

100+ parts

-

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845

$11.210

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Parana Technologies

USA . 1,072 parts In-Stock

1+ parts

$17.176

100+ parts

$1,595.062

1k+ parts

$15.458

10k+ parts

-

1,072

$17.176

$1,595.062

$15.458

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DigiPath Technology Company

USA . 47 parts In-Stock

1+ parts

$18.913

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-

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47

$18.913

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IDEA Electronic Components Group

UK . 1,785 parts In-Stock

1+ parts

$19.299

100+ parts

$18.334

1k+ parts

$17.369

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-

1,785

$19.299

$18.334

$17.369

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ChromeModa Solutions

Germany . 1,173 parts In-Stock

1+ parts

$19.299

100+ parts

$15.825

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1,173

$19.299

$15.825

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Corphita

USA . 1,079 parts In-Stock

1+ parts

$169.401

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1,079

$169.401

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Ampacity Inc.

Singapore . 4,015 parts In-Stock

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$348.210

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4,015

$348.210

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A-Z Elektronik GmbH

Germany . 7,101 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,734 parts In-Stock

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4,734

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Lixinc

USA . 2,681 parts In-Stock

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2,681

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Kepictronics

USA . 1,600 parts In-Stock

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1,600

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Futuretech Components

Singapore . 453 parts In-Stock

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453

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Experience unparalleled precision and efficiency with the Texas Instruments ADS5463IPFPR Analog-to-Digital Converter. Crafted with excellence and reliability in mind, this cutting-edge device is perfect for a wide range of applications in various industries. From industrial automation to telecommunications, the ADS5463IPFPR delivers exceptional performance, accuracy, and speed, making it the go-to choice for professionals seeking top-tier quality. Elevate your projects with the value and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving in design layouts.

No. of Bits: 12

12 bits provide high resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.061%

The low linearity error ensures precise conversion of analog signals.

Power Supplies (V): 3.3,5

Compatible with common power supplies, offering flexibility in application requirements.

No. of Terminals: 80

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

These package styles offer a variety of mounting options to suit different design needs.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for use in both hot and cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold ensures excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position simplifies installation and connection processes.

Maximum Seated Height: 1.2 mm

The low seated height makes the product suitable for applications with space constraints.

Width: 12 mm

The compact width size facilitates easy integration into different system designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the risk of damage during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables robust soldering for secure connections.

Length: 12 mm

The small length size allows for convenient placement in tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh conditions.

Maximum Analog Input Voltage: 2.2 V

The high analog input voltage capability accommodates a wide range of signal levels.

Sample Rate: 500 MHz

The high sample rate enables rapid conversion of analog signals to digital data.

Technology: BIPOLAR

The bipolar technology ensures accurate and stable conversion performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies surface mount assembly and enhances connectivity.

Maximum Supply Current: 330 mA

The low supply current consumption makes the product energy-efficient.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method offers unique and optimized signal conversion capabilities.

Nominal Supply Voltage: 3.3 V

The standard supply voltage compatibility simplifies power requirements in applications.

Output Bit Code: OFFSET BINARY

The offset binary bit code ensures accurate representation of digital data.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting in compact spaces.

Minimum Analog Input Voltage: -2.2 V

The negative analog input voltage range accommodates a broad spectrum of signals.

Output Format: PARALLEL, WORD

The parallel and word output formats enhance data transfer efficiency and compatibility.

Sample and Hold/Track and Hold: TRACK

The track sample and hold feature ensures accurate data conversion and retention.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates good moisture resistance for reliable performance in humid conditions.

Technical Specifications

Analog-to-Digital Converters ADS5463IPFPR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

500 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.2 V

Maximum Analog Input Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

330 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

4

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

80

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP80,.55SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G80

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5463IPFPR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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