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ADS5401IZAYR

Texas Instruments

ADS5401IZAYR by Texas Instruments

ADS5401IZAYR by Texas Instruments is a 12-bit ADC with 800 MHz sample rate, 0.1221% linearity error, and 181 mA max supply current. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact square package with low profile and fine pitch grid array design.

Median Price

$210.540

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,427 parts In-Stock

1+ parts

$210.540

100+ parts

$190.575

1k+ parts

$181.500

10k+ parts

-

1,427

$210.540

$190.575

$181.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,367 parts In-Stock

1+ parts

$200.013

100+ parts

-

1k+ parts

-

10k+ parts

-

3,367

$200.013

-

-

-

Vyrian

USA . 3,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,210

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 221 parts In-Stock

1+ parts

$13.631

100+ parts

-

1k+ parts

$14.132

10k+ parts

-

221

$13.631

-

$14.132

-

DigiPath Technology Company

USA . 1,742 parts In-Stock

1+ parts

$15.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

$15.010

-

-

-

ChromeModa Solutions

Germany . 4,647 parts In-Stock

1+ parts

$15.316

100+ parts

$12.559

1k+ parts

-

10k+ parts

-

4,647

$15.316

$12.559

-

-

IDEA Electronic Components Group

UK . 645 parts In-Stock

1+ parts

$15.316

100+ parts

$14.550

1k+ parts

$13.784

10k+ parts

-

645

$15.316

$14.550

$13.784

-

AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$15.640

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$15.640

-

-

-

Native Components

USA . 148 parts In-Stock

1+ parts

$21.600

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$21.600

-

-

-

Northwest PG Solutions

USA . 2,229 parts In-Stock

1+ parts

$23.760

100+ parts

$21.384

1k+ parts

-

10k+ parts

-

2,229

$23.760

$21.384

-

-

Ampacity Inc.

Singapore . 1,069 parts In-Stock

1+ parts

$178.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

$178.960

-

-

-

Corphita

USA . 4,847 parts In-Stock

1+ parts

$189.486

100+ parts

-

1k+ parts

-

10k+ parts

-

4,847

$189.486

-

-

-

Microchip USA

USA . 2,086 parts In-Stock

1+ parts

$231.410

100+ parts

$225.240

1k+ parts

$222.160

10k+ parts

$219.070

2,086

$231.410

$225.240

$222.160

$219.070

Overview

Unlock unparalleled performance and precision with the Texas Instruments ADS5401IZAYR Analog-to-Digital Converter. Crafted with top-notch quality and expertise, this cutting-edge device offers exceptional value and benefits for a wide range of applications. From industrial automation to medical imaging, this converter delivers unmatched accuracy and reliability. Trust in Texas Instruments to elevate your projects to new heights with the ADS5401IZAYR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various electronic applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 12

With a high resolution of 12 bits, this ADC provides accurate digital conversion of analog signals, ensuring precision in data acquisition.

Maximum Linearity Error (EL): 0.1221 %

The low linearity error percentage contributes to the overall accuracy and reliability of the ADC's output readings.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in system design and operation, catering to different power requirements.

No. of Terminals: 196

Having a large number of terminals enables connectivity to various components and interfaces, enhancing the versatility of the ADC.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style optimizes space utilization on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the ADC's stability and performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the ADC to function effectively in cold temperature settings without sacrificing performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, maintaining reliable connections for data transmission.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier integration and mounting on the circuit board, enhancing the overall user experience.

Maximum Seated Height: 1.4 mm

The low seated height profile of the package contributes to a compact design and efficient use of space within electronic devices.

Width: 12 mm

The compact width dimension makes this ADC suitable for applications where space is a limiting factor, allowing for integration in small form factor devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature eases the assembly process and reduces the risk of damage to the ADC during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the reliability and durability of the ADC during the soldering process, preventing thermal damage.

Length: 12 mm

The compact length dimension enhances the overall space efficiency of the ADC, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the ADC can withstand a wide range of temperatures, making it ideal for industrial applications.

Maximum Analog Input Voltage: 1 V

Support for a maximum analog input voltage of 1V enables compatibility with a variety of signal sources, enhancing the ADC's versatility.

Sample Rate: 800 MHz

With a high sample rate of 800 MHz, this ADC can capture and convert analog signals quickly and accurately, suitable for high-speed data acquisition applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, ensuring consistent data transmission without the risk of loose connections.

Maximum Supply Current: 181 mA

The low maximum supply current requirement helps in reducing power consumption and heat generation, making the ADC energy-efficient and suitable for battery-powered devices.

Converter Type: ADC, PROPRIETARY METHOD

Being a proprietary ADC design, it offers unique features and performance advantages that set it apart from standard off-the-shelf converters, making it a preferred choice for specific applications.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures compatibility with standard power sources, making the ADC easy to integrate into existing electronic systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for both offset binary and 2's complement binary output bit codes provides flexibility in data representation, accommodating different processing requirements.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density mounting on the circuit board, optimizing space utilization and enabling compact electronic device designs.

Minimum Analog Input Voltage: -1 V

The support for negative analog input voltage of -1V allows the ADC to accurately convert a wide range of analog signals, expanding its applicability to various input sources.

Output Format: PARALLEL, WORD

The parallel and word output formats provide compatibility with different data processing systems and interfaces, enhancing the ADC's connectivity and versatility.

Sample and Hold/Track and Hold: TRACK

The track and hold sampling method ensures the accurate capture and conversion of analog signals at high frequencies, maintaining data integrity in dynamic signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the level of protection against moisture-related damage, ensuring the reliability and longevity of the ADC in various environmental conditions.

Technical Specifications

Analog-to-Digital Converters ADS5401IZAYR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1221 %

Sample Rate:

800 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

-1 V

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

181 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

196

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.472 in (12 mm)

Length:

0.472 in (12 mm)

Maximum Seated Height:

0.055 in (1.4 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA196,14X14,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B196

Qualified:

No

JESD-609 Code:

e1

Trade Compliance

ADS5401IZAYR Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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