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ADS5263IRGCR-NM

Texas Instruments

ADS5263IRGCR-NM by Texas Instruments

ADS5263IRGCR-NM by Texas Instruments is a 16-bit A/D converter with 4 analog in channels. It operates at temperatures ranging from -40 to 85°C and has a max linearity error of 0.0183%. Suitable for industrial applications, it features a package style of chip carrier, heat sink/slug, and very thin profile.

Median Price

$438.176

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,195 parts In-Stock

1+ parts

$438.176

100+ parts

$396.625

1k+ parts

$377.738

10k+ parts

-

4,195

$438.176

$396.625

$377.738

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,859 parts In-Stock

1+ parts

$416.267

100+ parts

-

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-

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2,859

$416.267

-

-

-

Vyrian

USA . 8,119 parts In-Stock

1+ parts

-

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8,119

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VNN

France . 862 parts In-Stock

1+ parts

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862

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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-

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 979 parts In-Stock

1+ parts

$9.210

100+ parts

-

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-

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979

$9.210

-

-

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.531

100+ parts

$10.004

1k+ parts

$10.004

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100

$10.531

$10.004

$10.004

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Corohmni

South Africa . 244 parts In-Stock

1+ parts

$12.376

100+ parts

-

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244

$12.376

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Parana Technologies

USA . 320 parts In-Stock

1+ parts

$15.452

100+ parts

-

1k+ parts

$15.833

10k+ parts

-

320

$15.452

-

$15.833

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ChromeModa Solutions

Germany . 6,588 parts In-Stock

1+ parts

$17.362

100+ parts

$14.237

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-

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6,588

$17.362

$14.237

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IDEA Electronic Components Group

UK . 1,861 parts In-Stock

1+ parts

$17.362

100+ parts

$16.494

1k+ parts

$15.626

10k+ parts

-

1,861

$17.362

$16.494

$15.626

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Microchip USA

USA . 3,393 parts In-Stock

1+ parts

$364.740

100+ parts

$362.120

1k+ parts

$355.290

10k+ parts

$348.460

3,393

$364.740

$362.120

$355.290

$348.460

Ampacity Inc.

Singapore . 3,903 parts In-Stock

1+ parts

$372.450

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3,903

$372.450

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Semicontronic

India . 3,722 parts In-Stock

1+ parts

$372.450

100+ parts

$363.139

1k+ parts

$361.276

10k+ parts

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3,722

$372.450

$363.139

$361.276

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Corphita

USA . 442 parts In-Stock

1+ parts

$394.358

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442

$394.358

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Component Stockers USA

USA . 5,440 parts In-Stock

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5,440

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Continental Prestige Electronics

USA . 3,879 parts In-Stock

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3,879

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Argo Parts USA

USA . 2,675 parts In-Stock

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2,675

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

-

100+ parts

$15.654

1k+ parts

-

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530

-

$15.654

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Bastille Electronics

Australia . 35 parts In-Stock

1+ parts

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35

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Overview

Unlock the power of precise digital-to-analog conversion with the ADS5263IRGCR-NM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. Ideal for a variety of applications, this 16-bit DAC offers unmatched performance and accuracy, ensuring seamless operation in industrial settings. With a compact design and easy surface mount installation, this chip is the perfect solution for your analog signal processing needs. Upgrade your systems today with the ADS5263IRGCR-NM and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the converter, making it ideal for various applications.

No. of Analog In Channels: 4

With four analog input channels, this converter can handle multiple input signals simultaneously, increasing its versatility.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package offers a compact design, making it easy to integrate into different electronic systems.

No. of Bits: 16

With a 16-bit resolution, this converter can provide high precision and accuracy in converting digital signals to analog, ensuring reliable performance.

Maximum Linearity Error (EL): 0.0183%

The low linearity error ensures that the output analog signal closely matches the input digital signal, maintaining accuracy in signal conversion.

Power Supplies (V): 1.8,3.3

With multiple voltage options, this converter can be used in a variety of power supply configurations, offering flexibility in design.

No. of Terminals: 64

The 64 terminals provide ample connection points for input/output signals and power, enabling seamless integration within a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer versatility in installation and cooling options, catering to different application requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making this converter suitable for industrial applications.

Technical Specifications

Digital-to-Analog Converters ADS5263IRGCR-NM attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Analog to Digital Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0183 %

Maximum Supply Current:

390 mA

No. of Bits:

16

No. of Functions:

1

No. of Analog In Channels:

4

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.8,3.3 V

Maximum Analog Input Voltage:

4 V

Minimum Analog Input Voltage:

-4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Trade Compliance

ADS5263IRGCR-NM Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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