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ADS5237IPAGT

Texas Instruments

ADS5237IPAGT by Texas Instruments

The Texas Instruments ADS5237IPAGT is a 10-bit ADC with 2 analog in channels, 65 MHz sample rate, and 0.0977% linearity error. It is used in industrial applications for precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,063 parts In-Stock

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5,063

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Digiode

USA . 2,566 parts In-Stock

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2,566

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Distributors (Availability)

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Native Components

USA . 54 parts In-Stock

1+ parts

$1.079

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54

$1.079

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Northwest PG Solutions

USA . 2,015 parts In-Stock

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$1.187

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$1.187

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One Stop Electronics

USA . 1,241 parts In-Stock

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$2.000

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1,241

$2.000

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AZTECH Wire

Italy . 411 parts In-Stock

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$9.152

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411

$9.152

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Corohmni

South Africa . 36 parts In-Stock

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$14.586

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36

$14.586

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Parana Technologies

USA . 246 parts In-Stock

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$16.183

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$16.504

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246

$16.183

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$16.504

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DigiPath Technology Company

USA . 950 parts In-Stock

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$17.819

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950

$17.819

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ChromeModa Solutions

Germany . 3,090 parts In-Stock

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$18.183

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$14.910

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$18.183

$14.910

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

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$18.183

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$17.274

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$16.365

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1,738

$18.183

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$16.365

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Corphita

USA . 2,558 parts In-Stock

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Microchip USA

USA . 403 parts In-Stock

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Overview

Elevate your analog-to-digital conversion processes with the ADS5237IPAGT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. Ideal for a wide range of applications, this Analog-to-Digital Converter offers precision and efficiency like no other. Experience the value and benefits of seamless conversion with the ADS5237IPAGT and elevate your projects to new heights.Unlock unparalleled performance with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to environmental factors, making the product suitable for a variety of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple analog signals to be converted, increasing the versatility of the product.

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on the PCB, making the product ideal for compact designs.

No. of Bits: 10

With 10 bits, this ADC offers relatively good resolution for converting analog signals into digital data with sufficient precision.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error ensures accurate and reliable conversion of analog signals, making it suitable for applications where precision is crucial.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V, this ADC is compatible with many standard power supplies, simplifying integration into existing systems.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The compact and thin profile design with fine pitch terminals saves space on the PCB and allows for high-density mounting, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding environmental conditions, increasing the product's durability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the ADC energy-efficient and reliable in noisy environments.

Technical Specifications

Analog-to-Digital Converters ADS5237IPAGT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.02 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

4

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5237IPAGT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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