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ADS5203IPFBRG4

Texas Instruments

ADS5203IPFBRG4 by Texas Instruments

ADS5203IPFBRG4 by Texas Instruments is a 10-bit ADC with 2 analog input channels, operating at a sample rate of 40 MHz. It features a max linearity error of 0.1465%, suitable for industrial applications requiring precise analog-to-digital conversion in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,489 parts In-Stock

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Digiode

USA . 809 parts In-Stock

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Northwest PG Solutions

USA . 1,922 parts In-Stock

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$2.552

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One Stop Electronics

USA . 1,447 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 811 parts In-Stock

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Parana Technologies

USA . 1,474 parts In-Stock

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$18.130

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$18.274

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ChromeModa Solutions

Germany . 3,919 parts In-Stock

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$20.371

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$16.704

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IDEA Electronic Components Group

UK . 2,286 parts In-Stock

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$20.371

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$19.352

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$18.334

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Corphita

USA . 3,752 parts In-Stock

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Native Components

USA . 869 parts In-Stock

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Microchip USA

USA . 362 parts In-Stock

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DigiPath Technology Company

USA . 339 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the ADS5203IPFBRG4 Analog-to-Digital Converter. This cutting-edge technology offers precise conversion capabilities in a compact, surface-mount package, making it ideal for a variety of industrial applications. With a maximum linearity error of just 0.1465%, this converter ensures accurate and consistent performance, while its 40 MHz sample rate guarantees speedy data acquisition. Trust in Texas Instruments to deliver outstanding value and innovative solutions for your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

No. of Analog In Channels: 2

Allows for multiple analog signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Enables easy integration onto printed circuit boards, saving space and simplifying assembly.

No. of Bits: 10

Offers a high resolution for accurate digital conversion of analog signals.

Maximum Linearity Error (EL): 0.1465%

Ensures precise conversion with minimal error, resulting in accurate digital representation of analog input.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage, making it compatible with various systems.

No. of Terminals: 48

Provides multiple connection points for interfacing with other components, increasing versatility.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

Facilitates a compact design and easy installation, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand extreme temperatures, suitable for industrial and outdoor use.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections, ensuring long-term performance.

Technology: CMOS

Offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Analog-to-Digital Converters ADS5203IPFBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1465 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-1 V

Maximum Analog Input Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS5203IPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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