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ADS4245IRGC25

Texas Instruments

ADS4245IRGC25 by Texas Instruments

The Texas Instruments ADS4245IRGC25 is a 14-bit ADC with 2 analog input channels, operating at a sample rate of 125 MHz. It features a max linearity error of 0.03% and operates within an industrial temperature range. This Analog-to-Digital Converter is suitable for applications requiring high-speed and accurate conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,460 parts In-Stock

1+ parts

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2,460

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Digiode

USA . 274 parts In-Stock

1+ parts

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274

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 843 parts In-Stock

1+ parts

$8.769

100+ parts

-

1k+ parts

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843

$8.769

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Northwest PG Solutions

USA . 110 parts In-Stock

1+ parts

$9.645

100+ parts

$8.681

1k+ parts

-

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110

$9.645

$8.681

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One Stop Electronics

USA . 1,506 parts In-Stock

1+ parts

$12.000

100+ parts

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1,506

$12.000

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Parana Technologies

USA . 1,860 parts In-Stock

1+ parts

$15.532

100+ parts

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$15.905

10k+ parts

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1,860

$15.532

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$15.905

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DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$17.103

100+ parts

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1,167

$17.103

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ChromeModa Solutions

Germany . 2,435 parts In-Stock

1+ parts

$17.452

100+ parts

$14.311

1k+ parts

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2,435

$17.452

$14.311

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IDEA Electronic Components Group

UK . 1,654 parts In-Stock

1+ parts

$17.452

100+ parts

$16.579

1k+ parts

$15.707

10k+ parts

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1,654

$17.452

$16.579

$15.707

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AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$19.717

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380

$19.717

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Corphita

USA . 2,770 parts In-Stock

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2,770

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Microchip USA

USA . 209 parts In-Stock

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209

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Overview

Unlock the power of precise data conversion with the ADS4245IRGC25 by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments ensures top-notch quality and reliability. Ideal for applications requiring accurate measurements, this converter offers exceptional performance with minimal linearity error. With a compact design and industrial temperature grade, this converter is perfect for a wide range of projects. Experience seamless integration and superior results with the ADS4245IRGC25 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the converter, making it suitable for a variety of applications.

No. of Analog In Channels: 2

Allows for multiple input channels, increasing flexibility and compatibility with different signal sources.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Optimizes space utilization on PCBs and enhances overall layout efficiency.

No. of Bits: 14

Ensures high resolution and accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.03 %

Achieves precise and consistent conversion results with minimal error margin.

Power Supplies (V): 1.8

Operates efficiently with a low power supply voltage, reducing energy consumption and heat generation.

No. of Terminals: 64

Offers sufficient connectivity options for interfacing the converter with external devices or components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management, overall reliability, and compatibility with various mounting methods.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high-temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without compromising performance or accuracy.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity, corrosion resistance, and durability for long-term use.

Terminal Position: QUAD

Facilitates secure and stable connections during installation and operation.

Maximum Seated Height: 1 mm

Helps in maintaining a low profile and compact design for space-constrained applications.

Width: 9 mm

Compact form factor enables easy integration into various electronic systems and layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly process, increasing product lifespan.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes, enabling robust connections on PCBs.

Length: 9 mm

Compact dimensions enable seamless integration and installation in limited space environments.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh operating conditions commonly found in industrial settings.

Maximum Analog Input Voltage: 2 V

Supports a wide range of input signal levels, ensuring compatibility with various sensor outputs.

Sample Rate: 125 MHz

Offers high-speed data conversion capabilities for real-time applications and high-frequency signals.

Terminal Form: NO LEAD

Complies with environmental regulations, reducing the use of hazardous materials in the product.

Converter Type: ADC, FLASH METHOD

Utilizes flash conversion technique for fast and accurate analog-to-digital signal processing.

Nominal Supply Voltage: 1.8 V

Operates efficiently and reliably at a low supply voltage, conserving power and reducing heat dissipation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Provides flexibility in choosing output format, based on system requirements and compatibility.

Terminal Pitch: 0.5 mm

Enables precise and secure connections with minimal spacing between terminals for compact designs.

Minimum Analog Input Voltage: 0 V

Accepts zero voltage inputs, allowing for a wide dynamic range of analog signals to be converted.

Output Format: PARALLEL, WORD

Supports multiple output formats for seamless integration with different data processing systems and interfaces.

Sample and Hold/Track and Hold: SAMPLE

Uses sample and hold technique for accurate and stable conversion of varying analog input signals.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture-induced damage, enhancing product reliability and durability.

Technical Specifications

Analog-to-Digital Converters ADS4245IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.03 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS4245IRGC25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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