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ADS4225IRGCR

Texas Instruments

ADS4225IRGCR by Texas Instruments

The Texas Instruments ADS4225IRGCR is a 12-bit ADC with 2 analog in channels, operating at a sample rate of 125 MHz. It features a max linearity error of 0.085%, suitable for industrial applications requiring precise analog-to-digital conversion. With a compact chip carrier package and low power consumption of 150 mA, it is ideal for space-constrained designs in harsh environments.

Median Price

$30.583

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,294 parts In-Stock

1+ parts

$30.583

100+ parts

$27.185

1k+ parts

$19.989

10k+ parts

-

12,294

$30.583

$27.185

$19.989

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,526 parts In-Stock

1+ parts

$29.054

100+ parts

-

1k+ parts

-

10k+ parts

-

3,526

$29.054

-

-

-

Vyrian

USA . 8,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,743

-

-

-

-

Chip Stock

USA . 506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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506

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,219 parts In-Stock

1+ parts

$14.675

100+ parts

$1,362.816

1k+ parts

$13.208

10k+ parts

-

2,219

$14.675

$1,362.816

$13.208

-

DigiPath Technology Company

USA . 190 parts In-Stock

1+ parts

$16.159

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$16.159

-

-

-

ChromeModa Solutions

Germany . 3,040 parts In-Stock

1+ parts

$16.489

100+ parts

$13.521

1k+ parts

-

10k+ parts

-

3,040

$16.489

$13.521

-

-

IDEA Electronic Components Group

UK . 263 parts In-Stock

1+ parts

$16.489

100+ parts

$15.665

1k+ parts

$14.840

10k+ parts

-

263

$16.489

$15.665

$14.840

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AZTECH Wire

Italy . 964 parts In-Stock

1+ parts

$19.830

100+ parts

-

1k+ parts

-

10k+ parts

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964

$19.830

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-

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Corphita

USA . 909 parts In-Stock

1+ parts

$27.525

100+ parts

-

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-

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909

$27.525

-

-

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Lixinc

USA . 3,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,548

-

-

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Native Components

USA . 859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.288

10k+ parts

-

859

-

-

$3.288

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Northwest PG Solutions

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.322

10k+ parts

-

412

-

-

$3.322

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Overview

Experience unparalleled precision and performance with the ADS4225IRGCR by Texas Instruments, leaders in analog-to-digital converters. This cutting-edge product boasts exceptional quality and reliability, perfect for a variety of applications. With its 12-bit resolution and low linearity error, customers can trust in the accuracy of their data acquisition. The compact package design and wide temperature range make it suitable for industrial use, while the high-speed sample rate ensures efficient operation. Trust Texas Instruments to deliver superior technology that exceeds expectations. Unlock the full potential of your projects with the ADS4225IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components within the package, ensuring a longer lifespan for the product.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and flexibility in data acquisition tasks.

Surface Mount: YES

Surface mount technology makes installation and integration easier and more efficient, saving time and effort during assembly.

No. of Bits: 12

With a higher number of bits, this ADC can provide higher resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.085%

The low linearity error ensures accurate conversion of analog signals to digital, resulting in reliable and precise data outputs.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V makes this ADC energy-efficient and suitable for applications where power consumption is a concern.

No. of Terminals: 64

Having 64 terminals allows for multiple connection options and configurations, giving users flexibility in system design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles makes this ADC compact, efficient in dissipating heat, and suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this ADC can withstand harsh environmental conditions and maintain performance under extreme temperatures.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliable performance even in cold environments, making this ADC versatile in various applications.

Technical Specifications

Analog-to-Digital Converters ADS4225IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.085 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

150 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS4225IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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