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ADS1202IPWTG4

Texas Instruments

ADS1202IPWTG4 by Texas Instruments

ADS1202IPWTG4 by Texas Instruments is a Motion Control IC with 8 terminals, operating at 5V. It features a small outline package style and can withstand temperatures from -40 to 85°C. Ideal for industrial applications like brush DC motor control due to its CMOS technology and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,710 parts In-Stock

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8,710

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Digiode

USA . 473 parts In-Stock

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473

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 224 parts In-Stock

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$0.500

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224

$0.500

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Semicontronic

India . 386 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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386

$2.500

$2.438

$2.425

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AZTECH Wire

Italy . 791 parts In-Stock

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$10.681

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791

$10.681

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Parana Technologies

USA . 1,633 parts In-Stock

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$19.707

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$19.694

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1,633

$19.707

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$19.694

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DigiPath Technology Company

USA . 1,116 parts In-Stock

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$21.700

100+ parts

$19.964

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1,116

$21.700

$19.964

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ChromeModa Solutions

Germany . 4,489 parts In-Stock

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$22.143

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$18.157

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4,489

$22.143

$18.157

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IDEA Electronic Components Group

UK . 779 parts In-Stock

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$22.143

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$21.036

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$19.929

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779

$22.143

$21.036

$19.929

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Native Components

USA . 513 parts In-Stock

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$35.790

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$34.358

513

$35.790

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$34.358

Northwest PG Solutions

USA . 569 parts In-Stock

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$39.369

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569

$39.369

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Corphita

USA . 2,536 parts In-Stock

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Corohmni

South Africa . 169 parts In-Stock

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iodParts Technologies Inc.

India . 128 parts In-Stock

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$7.964

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128

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$7.964

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Overview

Elevate your motion control applications with the ADS1202IPWTG4 from Texas Instruments. Designed with precision and quality in mind, this compact IC offers unmatched performance and reliability. Whether you're looking to enhance the efficiency of your brush DC motor controller or streamline your industrial automation systems, this versatile component delivers unparalleled value and benefits. Trust in Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that allows for easy handling and protection of the IC.

Surface Mount: YES

Easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage requirement that can be easily met with common power sources.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures may be encountered, ensuring reliable operation.

Maximum Seated Height: 1.2 mm

Low profile design that saves space in compact electronic devices.

Technology: CMOS

Efficient and reliable technology for controlling motion in various applications.

Technical Specifications

Motion Control ICs ADS1202IPWTG4 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

9.5 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

ADS1202IPWTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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