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ADS1110A3IDBVR

Texas Instruments

ADS1110A3IDBVR by Texas Instruments

Texas Instruments ADS1110A3IDBVR is a 16-bit ADC with 0.01% EL, operating at -40 to 85 °C. It has a sample rate of 0.000308 MHz and supports input voltage range from -0.2V to 5.7V. Ideal for industrial applications requiring precise analog-to-digital conversion in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 4,550 parts In-Stock

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4,550

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Vyrian

USA . 4,460 parts In-Stock

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4,460

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Digiode

USA . 898 parts In-Stock

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898

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Distributors (Availability)

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Parana Technologies

USA . 72 parts In-Stock

1+ parts

$9.253

100+ parts

$859.312

1k+ parts

$8.328

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72

$9.253

$859.312

$8.328

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DigiPath Technology Company

USA . 138 parts In-Stock

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$10.189

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$9.374

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138

$10.189

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IDEA Electronic Components Group

UK . 1,498 parts In-Stock

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$10.397

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$9.877

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$9.357

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1,498

$10.397

$9.877

$9.357

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ChromeModa Solutions

Germany . 933 parts In-Stock

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$10.397

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$8.526

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933

$10.397

$8.526

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AZTECH Wire

Italy . 633 parts In-Stock

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$13.256

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633

$13.256

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One Stop Electronics

USA . 378 parts In-Stock

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$15.000

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378

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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Kepictronics

USA . 18,000 parts In-Stock

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Corphita

USA . 4,368 parts In-Stock

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Northwest PG Solutions

USA . 782 parts In-Stock

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Microchip USA

USA . 393 parts In-Stock

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Native Components

USA . 41 parts In-Stock

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Overview

Experience precision and reliability with the ADS1110A3IDBVR Analog-to-Digital Converter by Texas Instruments. Crafted with utmost quality, this converter offers unparalleled accuracy in converting analog signals to digital data. Perfect for industrial applications, this small outline, low profile device is designed to deliver optimal performance even in extreme temperatures. With a maximum linearity error of just 0.01%, customers can trust in the precision of their measurements. Upgrade your systems today with the ADS1110A3IDBVR and enjoy the benefits of high-quality digital conversion technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable, this ADC is easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Bits: 16

With 16 bits of resolution, this ADC offers high accuracy in converting analog signals to digital, providing precise data acquisition.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, making it versatile and suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, ensuring reliable performance in challenging thermal environments.

Converter Type: ADC, DELTA-SIGMA

Utilizes delta-sigma architecture for high-resolution and low-noise conversion, making it suitable for precision measurement tasks.

Technical Specifications

Analog-to-Digital Converters ADS1110A3IDBVR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.01 %

Sample Rate:

308 Hz

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.7 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

6

Terminal Form:

Terminal Pitch:

0.037 in (0.95 mm)

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.114 in (2.9 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSOP6,.11,37

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G6

Qualified:

No

Trade Compliance

ADS1110A3IDBVR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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