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ADS1000A0IDBVRG4

Texas Instruments

ADS1000A0IDBVRG4 by Texas Instruments

ADS1000A0IDBVRG4 by Texas Instruments is a 12-bit ADC with 0.0244% linearity error, operating at 5V. It features a small outline package suitable for industrial applications. With a sample rate of 0.000184 MHz and serial output format, it is ideal for precision data acquisition in temperature-sensitive environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,760 parts In-Stock

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Digiode

USA . 4,528 parts In-Stock

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Vyrian

USA . 4,351 parts In-Stock

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VNN

France . 773 parts In-Stock

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Nova Conductors

Japan . 80 parts In-Stock

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80

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Distributors (Availability)

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Parana Technologies

USA . 1,888 parts In-Stock

1+ parts

$9.067

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$9.728

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1,888

$9.067

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$9.728

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DigiPath Technology Company

USA . 1,069 parts In-Stock

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$9.984

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One Stop Electronics

USA . 1,151 parts In-Stock

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$10.000

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ChromeModa Solutions

Germany . 1,466 parts In-Stock

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$10.188

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$8.354

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IDEA Electronic Components Group

UK . 683 parts In-Stock

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$10.188

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$9.679

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$9.169

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683

$10.188

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$9.169

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AZTECH Wire

Italy . 355 parts In-Stock

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$16.984

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355

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Ampacity Inc.

Singapore . 352 parts In-Stock

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$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 22,161 parts In-Stock

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Microchip USA

USA . 3,760 parts In-Stock

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Corphita

USA . 2,367 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Experience the precision and reliability of Texas Instruments with the ADS1000A0IDBVRG4 Analog-to-Digital Converter. This high-quality product offers unparalleled accuracy and performance for a wide range of applications. With its compact design and advanced technology, this converter provides customers with a seamless and efficient solution for their analog-to-digital conversion needs. Trust Texas Instruments to deliver excellence in every aspect of your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the Analog-to-Digital Converter.

No. of Bits: 12

With 12 bits of resolution, this converter can provide a higher level of accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.0244 %

The low maximum linearity error ensures that the output digital values closely match the input analog signal, maintaining accuracy in the conversion process.

Power Supplies (V): 5

Operating at a supply voltage of 5V makes it compatible with standard power sources, offering ease of integration in various electronic systems.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile package style allows for efficient use of space on PCBs, making it suitable for applications where size constraints are a concern.

Maximum Analog Input Voltage: 5.7 V

Being able to handle a maximum analog input voltage of 5.7V allows for versatility in accepting a wide range of input signals without risking damage to the converter.

Sample Rate: 0.000184 MHz

The high sample rate enables the converter to quickly and accurately capture and convert analog signals into digital data, essential for applications requiring real-time processing.

Technical Specifications

Analog-to-Digital Converters ADS1000A0IDBVRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

184 Hz

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.7 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

150 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

6

Terminal Form:

Terminal Pitch:

0.037 in (0.95 mm)

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.114 in (2.9 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSOP6,.11,37

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G6

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1000A0IDBVRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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