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ADC78H90CIMT

Texas Instruments

ADC78H90CIMT by Texas Instruments

Texas Instruments ADC78H90CIMT is a 12-bit ADC with 8 analog in channels, 0.0244% EL, and 1.625us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 5,374 parts In-Stock

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Chip Stock

USA . 4,000 parts In-Stock

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Digiode

USA . 3,126 parts In-Stock

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Anansix

USA . 1,198 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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VNN

France . 641 parts In-Stock

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641

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Semtec, LLC

USA . 268 parts In-Stock

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ComSIT Distribution GmbH

Germany . 57 parts In-Stock

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Corohmni

South Africa . 520 parts In-Stock

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$6.246

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520

$6.246

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AZTECH Wire

Italy . 381 parts In-Stock

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$6.640

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$6.640

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One Stop Electronics

USA . 132 parts In-Stock

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$14.000

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Parana Technologies

USA . 379 parts In-Stock

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$24.133

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$24.785

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DigiPath Technology Company

USA . 1,296 parts In-Stock

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$26.574

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$24.448

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ChromeModa Solutions

Germany . 2,759 parts In-Stock

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$27.116

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$22.235

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IDEA Electronic Components Group

UK . 1,855 parts In-Stock

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$27.116

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$25.760

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$24.404

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Ampacity Inc.

Singapore . 1,068 parts In-Stock

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$33.000

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Semicontronic

India . 535 parts In-Stock

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$38.000

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$37.050

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$36.860

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Lixinc

USA . 13,776 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 5,756 parts In-Stock

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Corphita

USA . 4,112 parts In-Stock

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Argo Parts USA

USA . 3,400 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,426 parts In-Stock

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Microchip USA

USA . 493 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

USA . 168 parts In-Stock

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Overview

Unlock the power of precision with the ADC78H90CIMT by Texas Instruments, a top-tier manufacturer renowned for its cutting-edge technology and reliable products. As a leading Analog-to-Digital Converter in its category, this device offers unparalleled accuracy and efficiency, making it ideal for a wide range of applications. From industrial automation to medical equipment, this versatile converter provides seamless integration, high performance, and exceptional value for customers seeking top-notch quality and reliability in their projects. Experience the difference with Texas Instruments and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, making the product ideal for compact and portable designs.

No. of Analog In Channels: 8

Having 8 analog input channels allows for the conversion of multiple analog signals simultaneously, increasing efficiency and versatility.

No. of Bits: 12

With 12 bits resolution, this ADC provides high accuracy and precision in converting analog signals to digital, making it suitable for sensitive applications.

Power Supplies (V): 3/5

The flexibility to operate at both 3V and 5V power supplies makes this ADC compatible with a wide range of systems and applications.

Maximum Conversion Time: 1.625 us

The fast conversion time of 1.625 microseconds ensures quick and efficient analog-to-digital conversion, enabling real-time processing of data.

Technical Specifications

Analog-to-Digital Converters ADC78H90CIMT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

500 kHz

Hold Mode:

Track

Maximum Conversion Time:

1.625 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

ADC78H90CIMT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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