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ADC78H89CIMT

Texas Instruments

ADC78H89CIMT by Texas Instruments

ADC78H89CIMT by Texas Instruments is a 12-bit ADC with 7 analog input channels, 0.0244% max linearity error, and 1.625 us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

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9

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Digiode

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Anansix

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Sea View Technologies

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Bristol Electronics

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ComSIT Distribution GmbH

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Connector Distribution Corp

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Right Parts Inc.

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One Stop Electronics

USA . 401 parts In-Stock

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AZTECH Wire

Italy . 769 parts In-Stock

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Corohmni

South Africa . 780 parts In-Stock

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Parana Technologies

USA . 2,223 parts In-Stock

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DigiPath Technology Company

USA . 1,090 parts In-Stock

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ChromeModa Solutions

Germany . 1,384 parts In-Stock

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IDEA Electronic Components Group

UK . 781 parts In-Stock

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Native Components

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Northwest PG Solutions

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GreenTree Electronics

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Computer Components Inc. - USA

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Unlock a world of precision with the ADC78H89CIMT by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this converter boasts 7 analog input channels and 12 bits for accurate conversion. With a small outline and thin profile, it's perfect for industrial settings where space is limited. Experience swift conversion times and minimal linearity error, all while enjoying the trusted performance of Texas Instruments. Elevate your projects with the ADC78H89CIMT - the ultimate choice for seamless conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and resistance to environmental factors, making this product suitable for a wide range of applications.

No. of Analog In Channels: 7

Having 7 analog input channels allows for multiple signals to be converted simultaneously, enhancing the versatility and efficiency of the product.

Surface Mount: YES

The surface mount capability enables easy integration into compact electronic designs, saving space and simplifying the assembly process.

No. of Bits: 12

With a resolution of 12 bits, this product can provide precise and accurate digital conversion of analog signals, ensuring high-quality data capture.

Maximum Linearity Error (EL): 0.0244 %

The low maximum linearity error ensures that the converted digital output closely matches the input analog signal, maintaining data integrity and fidelity.

Power Supplies (V): 3/5

Support for power supplies of 3V and 5V offers flexibility in operating voltage requirements, making this product compatible with a variety of systems.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for interfacing with other components or devices, facilitating seamless integration into different circuits.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make the product suitable for space-constrained applications while maintaining high performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability and stability even in harsh environmental conditions, enhancing the product's overall durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function efficiently in both extreme cold and hot environments, making it versatile and dependable.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable operation of the product.

Maximum Conversion Time: 1.625 us

The fast conversion time of 1.625 microseconds allows for quick and efficient processing of analog signals, enabling real-time data acquisition and analysis.

Maximum Seated Height: 1.1 mm

The low maximum seated height makes the product suitable for applications where space is limited, allowing for compact and streamlined designs.

Width: 4.4 mm

The narrow width of 4.4mm enables the product to be used in small form factor devices and systems, contributing to overall space savings and portability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during manufacturing processes, leading to robust and long-lasting connections.

Length: 5 mm

The compact length of 5mm further enhances the product's suitability for space-constrained applications, allowing for efficient integration into various electronic setups.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand a wide range of temperature variations commonly encountered in industrial environments, guaranteeing consistent performance.

Maximum Analog Input Voltage: 5.25 V

Support for a maximum analog input voltage of 5.25V provides versatility in signal processing capabilities, accommodating a wide range of input signal levels.

Sample Rate: 0.5 MHz

The high sample rate of 0.5 MHz allows for rapid and accurate conversion of analog signals into digital data, enabling efficient data capture in time-sensitive applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high noise immunity, and fast operation, making it an energy-efficient and reliable choice.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly onto PCBs, enhancing the product's usability and reliability in electronic circuits.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high accuracy and speed in converting analog signals, providing precise digital output for various applications requiring high-performance data acquisition.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources, simplifying the product's integration into existing electronic systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and analysis, making it easy to interface with digital systems and perform calculations efficiently.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for close spacing of terminals on the package, enabling compact design layouts and efficient signal routing in electronic circuits.

Minimum Analog Input Voltage: 0 V

Support for a minimum analog input voltage of 0V ensures compatibility with a wide range of signal sources, making the product versatile for different input signal levels.

Output Format: SERIAL

The serial output format enables data transmission in a sequential manner, simplifying data communication and processing in systems where serial interfaces are commonly used.

Sample and Hold/Track and Hold: TRACK

The track sample and hold feature allows for precise and stable signal capture during conversion, ensuring accurate representation of analog signals in the digital domain.

Technical Specifications

Analog-to-Digital Converters ADC78H89CIMT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

7

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

500 kHz

Hold Mode:

Track

Maximum Conversion Time:

1.625 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

ADC78H89CIMT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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