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ADC12DL3200ACF

Texas Instruments

ADC12DL3200ACF by Texas Instruments

Texas Instruments ADC12DL3200ACF is a 12-bit ADC with 2 channels, operating at 3200 MHz. It features a max analog input voltage of ±1.04V and supports output formats like serial and parallel. Ideal for industrial applications requiring high-speed data conversion in a compact square package.

Median Price

$2,338.140

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,022 parts In-Stock

1+ parts

$2,283.600

100+ parts

$2,093.300

1k+ parts

$1,903.000

10k+ parts

-

3,022

$2,283.600

$2,093.300

$1,903.000

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Chip1Stop

Japan . 112 parts In-Stock

1+ parts

$2,338.140

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-

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112

$2,338.140

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DigiKey

USA . 67 parts In-Stock

1+ parts

$3,229.840

100+ parts

-

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67

$3,229.840

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,780 parts In-Stock

1+ parts

$2,169.420

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-

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2,780

$2,169.420

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2,933.470

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-

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10

$2,933.470

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TME

Poland . 57 parts In-Stock

1+ parts

$3,375.810

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-

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57

$3,375.810

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Vyrian

USA . 658 parts In-Stock

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658

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VNN

France . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,936 parts In-Stock

1+ parts

$11.880

100+ parts

-

1k+ parts

$12.276

10k+ parts

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1,936

$11.880

-

$12.276

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ChromeModa Solutions

Germany . 5,131 parts In-Stock

1+ parts

$13.348

100+ parts

$10.945

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5,131

$13.348

$10.945

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IDEA Electronic Components Group

UK . 465 parts In-Stock

1+ parts

$13.348

100+ parts

$12.681

1k+ parts

$12.013

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465

$13.348

$12.681

$12.013

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Ampacity Inc.

Singapore . 929 parts In-Stock

1+ parts

$1,941.060

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929

$1,941.060

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Corphita

USA . 3,079 parts In-Stock

1+ parts

$2,055.240

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3,079

$2,055.240

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$2,874.801

100+ parts

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1k+ parts

$2,759.809

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50

$2,874.801

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$2,759.809

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Lixinc

USA . 10,617 parts In-Stock

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10,617

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 1,212 parts In-Stock

1+ parts

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100+ parts

$12.035

1k+ parts

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1,212

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$12.035

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Overview

Elevate your analog-to-digital conversion experience with the Texas Instruments ADC12DL3200ACF. Crafted with precision and quality in mind, this converter offers unmatched performance and reliability. Ideal for a wide range of applications, this product boasts a seamless integration process thanks to its surface mount design and square package shape. Whether you're in the industrial sector or tackling high-speed data acquisition projects, this ADC delivers exceptional value, benefits, and advantages that will take your designs to the next level. Trust in Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in capturing and converting analog signals.

Surface Mount: YES

Surface mount technology makes installation and assembly easier and more efficient.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space in the overall system.

No. of Bits: 12

This high resolution of 12 bits ensures accurate digital conversion of analog signals.

No. of Terminals: 256

With a large number of terminals, there are plenty of connection options for different configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy connection to other components in the system.

Maximum Seated Height: 3.31 mm

The low seated height allows for a compact and space-saving design.

Width: 17 mm

The moderate width makes the product versatile and compatible with various system designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps in efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and component bonding.

Length: 17 mm

The compact length makes the product suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Maximum Analog Input Voltage: 1.04 V

The high maximum analog input voltage allows for capturing a wide range of analog signals.

Sample Rate: 3200 MHz

The high sample rate enables fast and accurate analog-to-digital conversion.

Terminal Form: BALL

The ball terminal form offers easy and reliable connections in the system.

Maximum Supply Current: 1300 mA

The high maximum supply current ensures stable operation under heavy load conditions.

Converter Type: ADC, PROPRIETARY METHOD

The use of proprietary method in ADC ensures optimized performance and unique features.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage provides stable power for the operation of the ADC.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple output bit codes enhances compatibility with different systems and applications.

Terminal Pitch: 1 mm

The small terminal pitch allows for dense packing and space efficiency in the system.

Minimum Analog Input Voltage: -1.04 V

The low minimum analog input voltage enables capturing of negative analog signals without distortion.

Output Format: SERIAL, PARALLEL, WORD

Support for multiple output formats provides flexibility in data transmission and compatibility with different systems.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates good moisture resistance, making the product reliable in humid environments.

Technical Specifications

Analog-to-Digital Converters ADC12DL3200ACF attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Sample Rate:

3200 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.04 V

Maximum Analog Input Voltage:

1.04 V

Nominal Supply Voltage:

1.1 V

Maximum Supply Current:

1.3 A

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

256

Terminal Form:

Terminal Pitch:

0.039 in (1 mm)

Surface Mount:

Yes

Width:

0.669 in (17 mm)

Length:

0.669 in (17 mm)

Maximum Seated Height:

0.13 in (3.31 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array

Package Shape:

Package Equivalence Code:

BGA256,16X16,39

Package Code:

BGA

Standards and Codes

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

ADC12DL3200ACF Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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