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ADC12DJ3200NWE/EM

Texas Instruments

ADC12DJ3200NWE/EM by Texas Instruments

Texas Instruments ADC12DJ3200NWE/EM is a 12-bit ADC with 2 analog in channels, 3200 MHz sample rate, and 0.8V max analog input voltage. Ideal for high-speed data acquisition systems requiring precise conversion accuracy.

Median Price

$12,669.938

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33 parts In-Stock

1+ parts

$12,669.938

100+ parts

$11,312.445

1k+ parts

-

10k+ parts

-

33

$12,669.938

$11,312.445

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,237 parts In-Stock

1+ parts

$12,036.441

100+ parts

-

1k+ parts

-

10k+ parts

-

3,237

$12,036.441

-

-

-

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$14,655.130

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$14,655.130

-

-

-

Vyrian

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,777

-

-

-

-

VNN

France . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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32

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$7.235

100+ parts

-

1k+ parts

-

10k+ parts

-

741

$7.235

-

-

-

Parana Technologies

USA . 658 parts In-Stock

1+ parts

$24.471

100+ parts

-

1k+ parts

$25.140

10k+ parts

-

658

$24.471

-

$25.140

-

DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$26.946

100+ parts

-

1k+ parts

-

10k+ parts

-

1,992

$26.946

-

-

-

ChromeModa Solutions

Germany . 3,717 parts In-Stock

1+ parts

$27.496

100+ parts

$22.547

1k+ parts

-

10k+ parts

-

3,717

$27.496

$22.547

-

-

IDEA Electronic Components Group

UK . 590 parts In-Stock

1+ parts

$27.496

100+ parts

$26.121

1k+ parts

$24.746

10k+ parts

-

590

$27.496

$26.121

$24.746

-

Ampacity Inc.

Singapore . 33 parts In-Stock

1+ parts

$10,769.450

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$10,769.450

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-

-

Corphita

USA . 1,524 parts In-Stock

1+ parts

$11,402.944

100+ parts

-

1k+ parts

-

10k+ parts

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1,524

$11,402.944

-

-

-

Continental Prestige Electronics

USA . 6,976 parts In-Stock

1+ parts

$14,655.130

100+ parts

-

1k+ parts

-

10k+ parts

$14,362.027

6,976

$14,655.130

-

-

$14,362.027

Argo Parts USA

USA . 1,731 parts In-Stock

1+ parts

$14,655.130

100+ parts

$14,508.579

1k+ parts

$14,362.027

10k+ parts

$14,215.476

1,731

$14,655.130

$14,508.579

$14,362.027

$14,215.476

Netroflash

USA . 500 parts In-Stock

1+ parts

$14,655.130

100+ parts

$14,362.027

1k+ parts

-

10k+ parts

-

500

$14,655.130

$14,362.027

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-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

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-

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Overview

Unlock the power of precision with the Texas Instruments ADC12DJ3200NWE/EM Analog-to-Digital Converter. Manufactured by a trusted industry leader, this cutting-edge device boasts exceptional quality and reliability. Ideal for a wide range of applications, this converter offers unparalleled value and benefits to customers seeking high-performance solutions. Experience the advantages of this product and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and reliability, making the product suitable for high temperature and harsh environments.

No. of Analog In Channels: 2

Having 2 analog input channels allows for simultaneous conversion of multiple analog signals, increasing efficiency and versatility.

Package Shape: SQUARE

Square package shape offers compactness and easy integration into circuit designs, optimizing space utilization.

No. of Bits: 12

With 12 bits resolution, the product provides high accuracy in converting analog signals into digital data, ensuring precise and reliable results.

No. of Terminals: 196

Having 196 terminals enables versatile connectivity options and facilitates integration into complex electronic systems.

Package Style (Meter): GRID ARRAY

Grid array package style provides efficient heat dissipation and improved signal integrity, enhancing overall performance.

Maximum Seated Height: 6.194 mm

Low seated height allows for compact device design and efficient thermal management, making it suitable for space-constrained applications.

Width: 15 mm

Compact width dimension enables easy PCB layout and space-saving design considerations in electronic assemblies.

Length: 15 mm

Similar to width, the compact length dimension aids in space-efficient integration of the product into electronic systems.

Total Dose (V): 300k Rad(Si)

High radiation tolerance of 300k Rad(Si) ensures reliability in radiation-prone environments, making the product suitable for aerospace or medical applications.

Maximum Analog Input Voltage: 0.8 V

With a maximum analog input voltage of 0.8V, the product is compatible with a wide range of analog signals, making it versatile in various applications.

Sample Rate: 3200 MHz

High sample rate of 3200 MHz allows for fast and accurate data conversion, ensuring real-time processing of analog signals with minimal delay.

Maximum Supply Current: 1000 mA

Supporting a maximum supply current of 1000 mA, the product can handle demanding power requirements, making it suitable for high-performance applications.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary ADC conversion method ensures optimized performance and accuracy in converting analog signals to digital data.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage of 1.1V ensures consistent and reliable operation of the product in various operating conditions.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting both offset binary and 2's complement binary output bit codes provides flexibility in data representation, catering to different system requirements.

Terminal Pitch: 1 mm

Compact terminal pitch of 1mm facilitates easy soldering and connection to PCBs, enhancing ease of assembly and integration.

Minimum Analog Input Voltage: -0.8 V

Ability to handle a minimum analog input voltage of -0.8V allows for capturing a wide range of negative analog signals, enhancing the product's versatility.

Output Format: SERIAL

Serial output format simplifies data transmission and processing, offering compatibility with various digital interfaces and protocols.

Sample and Hold/Track and Hold: TRACK

Incorporating a track sample and hold feature ensures accurate conversion of varying analog signals, maintaining signal integrity and fidelity in converted data.

Technical Specifications

Analog-to-Digital Converters ADC12DJ3200NWE/EM attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

3200 MHz

Hold Mode:

Track

Electrical Specifications

Minimum Analog Input Voltage:

-800 mV

Maximum Analog Input Voltage:

800 mV

Nominal Supply Voltage:

1.1 V

Maximum Supply Current:

1 A

Operating Conditions

Total Ionizing Dose:

300k Rad(Si)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

196

Terminal Pitch:

0.039 in (1 mm)

Surface Mount:

No

Width:

0.591 in (15 mm)

Length:

0.591 in (15 mm)

Maximum Seated Height:

0.244 in (6.194 mm)

Packaging

Package Body Material:

Ceramic

Package Style:

Grid Array

Package Shape:

Package Code:

CGA

Standards and Codes

JESD-30 Code:

S-CCGA-X196

Trade Compliance

ADC12DJ3200NWE/EM Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8473.30.11.80

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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