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ADC12DJ2700AAV

Texas Instruments

ADC12DJ2700AAV by Texas Instruments

Texas Instruments ADC12DJ2700AAV is a 12-bit ADC with 2 analog channels, operating at 2700 MHz sample rate. It has a max analog input voltage of ±1.04 V and supports serial, parallel, and word output formats. Ideal for industrial applications requiring high-speed data conversion in compact designs.

Median Price

$1,787.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 809 parts In-Stock

1+ parts

$1,200.000

100+ parts

$1,100.000

1k+ parts

$1,000.000

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809

$1,200.000

$1,100.000

$1,000.000

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Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$1,787.600

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5

$1,787.600

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DigiKey

USA . 2 parts In-Stock

1+ parts

$2,415.550

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2

$2,415.550

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Distributors (In-Stock)

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Digiode

USA . 1,431 parts In-Stock

1+ parts

$1,140.000

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1,431

$1,140.000

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Nova Conductors

Japan . 10 parts In-Stock

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$2,085.440

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10

$2,085.440

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VNN

France . 4,968 parts In-Stock

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4,968

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Vyrian

USA . 2,569 parts In-Stock

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2,569

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Chip Stock

USA . 205 parts In-Stock

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205

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 697 parts In-Stock

1+ parts

$12.848

100+ parts

$1,193.135

1k+ parts

$11.563

10k+ parts

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697

$12.848

$1,193.135

$11.563

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DigiPath Technology Company

USA . 170 parts In-Stock

1+ parts

$14.147

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170

$14.147

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

1+ parts

$14.436

100+ parts

$13.714

1k+ parts

$12.992

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1,059

$14.436

$13.714

$12.992

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ChromeModa Solutions

Germany . 968 parts In-Stock

1+ parts

$14.436

100+ parts

$11.838

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968

$14.436

$11.838

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AZTECH Wire

Italy . 511 parts In-Stock

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$15.297

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511

$15.297

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Ampacity Inc.

Singapore . 272 parts In-Stock

1+ parts

$1,020.000

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272

$1,020.000

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Corphita

USA . 112 parts In-Stock

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$1,080.000

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112

$1,080.000

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2,085.440

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1k+ parts

$1,981.168

10k+ parts

$1,939.459

2,000

$2,085.440

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$1,981.168

$1,939.459

Lixinc

USA . 18,740 parts In-Stock

1+ parts

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18,740

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Discover the cutting-edge ADC12DJ2700AAV by Texas Instruments, a top-tier Analog-to-Digital Converter that promises unmatched precision and reliability. Crafted with high-quality materials and innovative design, this device is ideal for a wide range of applications. From industrial automation to telecommunications, this converter offers exceptional performance and accuracy, making it a valuable asset for your projects. Experience seamless integration, superior functionality, and enhanced efficiency with the ADC12DJ2700AAV - the ultimate solution for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, making it suitable for various environmental conditions.

No. of Analog In Channels: 2

Having 2 analog input channels allows for simultaneous conversion of multiple input signals, making the converter versatile for different applications.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially in compact electronic devices.

No. of Bits: 12

With a higher number of bits, the converter can provide more precise and accurate digital representation of analog signals.

No. of Terminals: 144

The large number of terminals allows for efficient connectivity and better overall performance of the converter.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables higher density integration on circuit boards, saving space and enhancing performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and stability of the converter even in challenging operating environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the converter to function effectively in cold environments without degradation in performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and reliability for the connections of the converter.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the circuit board, ensuring stability and efficiency.

Maximum Seated Height: 1.94 mm

The low seated height allows for a compact design, making the converter suitable for space-constrained applications.

Width: 10 mm

The compact width of the converter enables easy integration into various electronic systems without taking up much space.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the internal components can withstand the reflow process without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability indicates the converter's reliability and robustness during the manufacturing process.

Length: 10 mm

The compact length of the converter contributes to its space-saving design and ease of integration in various electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the converter can operate reliably in harsh industrial environments without performance degradation.

Maximum Analog Input Voltage: 1.04 V

The high maximum analog input voltage range allows the converter to handle a wide range of input signals without distortion or damage.

Sample Rate: 2700 MHz

The high sample rate enables the converter to quickly and accurately capture and convert analog signals into digital data for high-speed applications.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections for the converter, enhancing its overall performance and longevity.

Maximum Supply Current: 950 mA

The high maximum supply current rating indicates the converter's ability to handle power requirements efficiently and reliably.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method used in the converter ensures optimized performance and accuracy in analog-to-digital signal conversion.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage provides stable power to the converter for consistent and reliable operation in various applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The different output bit code options enable compatibility with different systems and signal processing requirements, increasing the converter's versatility.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on circuit boards, enhancing connectivity and performance.

Minimum Analog Input Voltage: -1.04 V

The low minimum analog input voltage range enables the converter to handle a wide range of input signals, ensuring flexibility in various applications.

Output Format: SERIAL, PARALLEL, WORD

The multiple output format options provide flexibility in interfacing with different systems and devices, enhancing the converter's compatibility.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 indicates that the converter can withstand moderate exposure to moisture during storage and operation.

Technical Specifications

Analog-to-Digital Converters ADC12DJ2700AAV attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Sample Rate:

2700 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-1.04 V

Maximum Analog Input Voltage:

1.04 V

Nominal Supply Voltage:

1.1 V

Maximum Supply Current:

950 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.076 in (1.94 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA144,12X12,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Trade Compliance

ADC12DJ2700AAV Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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